The Comparison of Sheet Resistances of Screen‐ and Stencil‐Printed Resistors
Source abstract
Abstract
The deposition of the precise thick‐film buried resistors (with better tolerance) is one of the factors that can increase the integration of the low‐temperature co‐fired ceramic devices further. The thick‐film buried resistors cannot be trimmed after sintering or the trimming is very difficult in the contradiction to the surface resistors. The possibility of utilizing simple stencil printing in the fabrication of thick‐film resistors is presented in this paper. Moreover, the comparison of the variability of the sheet resistances of the screen‐ and stencil‐printed buried resistors was performed using Taguchi Design of the Experiment methodology.
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Research context
OpenAlex topics: Electrical and Thermal Properties of Materials · Advanced Sensor Technologies Research · Ferroelectric and Piezoelectric Materials
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Affiliations
Faculty of Microsystem Electronics and Photonics Wroclaw University of Technology Zygmunta Janiszewskiego street 11/17 Wroclaw 50‐372 Poland
Funding
The National Center for Science (Poland)
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