journal article·2005-09Open access

Novel Microsystem Applications with New Techniques in Low‐Temperature Co‐Fired Ceramics

K. A. Peterson, K. D. Patel, C. K. Ho, S. B. Rohde, C. D. Nordquist, C. A. Walker, B. D. Wroblewski, M. Okandan

Abstract

Low‐temperature co‐fired ceramic (LTCC) enables development and testing of critical elements on microsystem boards as well as nonmicroelectronic meso‐scale applications. We describe silicon‐based microelectromechanical systems packaging and LTCC meso‐scale applications. Microfluidic interposers permit rapid testing of varied silicon designs. The application of LTCC to micro‐high‐performance liquid chromatography (μ‐HPLC) demonstrates performance advantages at very high pressures. At intermediate pressures, a ceramic thermal cell lyser has lysed bacteria spores without damaging the proteins. The stability and sensitivity of LTCC/chemiresistor smart channels are comparable to the performance of silicon‐based chemiresistors. A variant of the use of sacrificial volume materials has created channels, suspended thick films, cavities, and techniques for pressure and flow sensing. We report on inductors, diaphragms, cantilevers, antennae, switch structures, and thermal sensors suspended in air. The development of “functional‐as‐released” moving parts has resulted in wheels, impellers, tethered plates, and related new LTCC mechanical roles for actuation and sensing. High‐temperature metal‐to‐LTCC joining has been developed with metal thin films for the strong, hermetic interfaces necessary for pins, leads, and tubes.
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Research context

OpenAlex topics: Electrical and Thermal Properties of Materials · Gas Sensing Nanomaterials and Sensors · Ferroelectric and Piezoelectric Materials

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References (57)

Show source-provided references
1. 10.1016/S0924-4247(00)00554-910.1016/S0924-4247(00)00554-9 ↗
2. Jones W. K. · 2000 · 469
3. K. G.Ewsuk C. B.DiAntonio F.Uribe andS. L.Monroe “Materials and Process Control Technology for LTCC Microelectronics Packaging ”Proceedings of the Ceramic Interconnect Technology Conference IMAPS Denver CO 1–6 2004.
4. 10.1557/PROC-518-7310.1557/PROC-518-73 ↗
5. Wagner M. · 2002 · 71
6. 10.1016/j.jeurceramsoc.2003.07.01010.1016/j.jeurceramsoc.2003.07.010 ↗
7. 10.1088/0957-0233/8/1/01310.1088/0957-0233/8/1/013 ↗
8. 10.1088/0957-0233/11/8/30310.1088/0957-0233/11/8/303 ↗
9. 10.1023/A:100675032540510.1023/A:1006750325405 ↗
10. Birol H. · 2004 · 106
11. 10.1016/S0955-2219(01)00160-110.1016/S0955-2219(01)00160-1 ↗
12. D.Belavic M.Hrova S.Bencan W.Smetana H.Homolka R.Reicher L.Golonka A.Dziedzic andJ.Kita “Investigations of Thick‐Film Resistors on Different Substrates for Strain‐Gage Applications ”Proceedings of the International Symposium on Microelectronics 441–446 2002.
13. 10.1016/j.sna.2003.07.00310.1016/j.sna.2003.07.003 ↗
14. 10.1023/A:102538821495510.1023/A:1025388214955 ↗
15. 10.1016/j.sna.2003.10.05510.1016/j.sna.2003.10.055 ↗
16. Harmonics Inc. website:http://www.users.qwest.net/~hmnx/
17. 10.1016/S0924-4247(98)00238-610.1016/S0924-4247(98)00238-6 ↗
18. M.Gongora‐Rubio L.Sola‐Laguna J. J.Santiago‐Aviles andM.Smith “Integrated LTCC Coils for Multiple Applications in Meso‐Electromechanical Systems ”Proceedings of IMECE99:MEMS 189–194 1999.10.1115/IMECE1999-0266 ↗
19. A New Low‐Loss Microstrip Structure on LTCC Substrate
20. Peterson K. A. · 2004 · 19
21. Sippola C. B. · 2004 · 179
22. H.Adluru M. A.Zampino Y.Liu andW. K.Jones “Em‐Bedded Heat Exchanger in LTCC Substrate ”Proceedings of the Ceramic Interconnect Technology Conference IMAPS Denver CO 205–210 2003.
23. L.Rebenklau K. J.Wolter andS.Howitz “Realization of Hybrid Microfluidic Systems Using Standard LTCC Process ”Proceedings of the Electrical Composites and Technology Conference 1696–1700 2000.10.1109/ECTC.2000.853448 ↗
24. M.Gongora‐Rubio L.Sola‐Laguna M.Smith andJ. J.Santiago‐Aviles “A Meso‐Scale Electro‐Magnetically Actuated Normally Closed Valve Realized on LTCC Tapes ”Proceedings of the SPIE Conference on Microfluidic Devices and Systems II Santa Clara CA V3877 230–239 1999.10.1117/12.359341 ↗
25. Meso‐Scale Pres‐Sure Transducers Utilizing Low Temperature Co‐Fired Ceramic Tapes
26. S. B.RohdeandK. A.Peterson “Applying New LTCC/LIGA Construction Techniques in Realizing a Miniature Ion Mobility Spectrometer ”Presented at theIMAPS 35th Annual Symposium on Microelectronics Denver CO September 2002.
27. D. G.Plumlee M.Tam P.Dwivedi H.Hill J. A.Hartman andA. J.Moll “Ion Mobility Spectrometer (IMS) Fabricated in Low Temperature Cofire Ceramic (LTCC) ”Proceedings of the Ceramic Interconnect Technology Conference IMAPS Denver CO 240–245 2003.
28. 10.1109/TCAPT.2003.81147510.1109/TCAPT.2003.811475 ↗
29. Plumlee D. · 2004 · 115
30. B. B.Mathewson W. S.Newman A. H.Heuer andJ. D.Cawley “Automated Fabrication of Ceramic Components from Tape‐Cast Ceramic ”Proceedings of the Solid Freeform FabricationSymposium Austin TX 253–260 1995.
31. Computer‐Aided Manufacturing of Laminated Engineering Materials
32. 10.1088/0960-1317/12/3/30210.1088/0960-1317/12/3/302 ↗
33. Novel LTCC Fabrication Techniques Applied to a Rolled Ion Mobility Spectrometer
34. 10.1023/A:100677381461110.1023/A:1006773814611 ↗
35. D. G.Plumlee Y.Morales B.Cheek A. J.Paris H. A.Ackler W. B.Knowlton andA. J.Moll “Pressure Sensors Built in Low Temperature Co‐Fired Ceramic Materials ”Presented atIMAPS ATW Packaging of MEMS and Releate Micro Integrated Nano Systems September 6–8 2002 Denver CO.
36. J. W.Burdon R. F.Huang D.Wilcox andN. J.Naclerio “Method for Fabricating a Multilayered Structure and the Structures Formed by the Method ”U.S. Patent # 6 592 696 July 15 2003.
37. Cold Low Pressure Lamination of LTCC's
38. D. J.Miehls F. J.Martin R. G.Pond andP. S.Fleischner “Method of Fabricating a Multilayer Electrical Circuit Structure ”U.S. Patent #5 249 355 October 5 1993.
39. E. A.TrickettandR. C.Assmus “Ceramic Monolithic Structure Having an Internal Cavity Contained Therein and a Method of Preparing the Same ”U.S. Patent # 4 806 295 February 21 1989.
40. J. H.Alexander “Method of Making Ceramic Article with Cavity Using LTCC Tape ”U.S. Patent #5 601 673 February 11 1997.
41. J. D.Cawley A. H.Heuer andW. S.Newman “Method for Constructing Three Dimensional Bodies from Laminations ”U.S. Patent # 5 779 833 July 14 1998.
42. 10.1023/B:JMSC.0000012916.92366.4810.1023/B:JMSC.0000012916.92366.48 ↗
43. 10.1088/0960-1317/15/2/R0110.1088/0960-1317/15/2/R01 ↗
44. 10.1016/S0921-5107(02)00433-610.1016/S0921-5107(02)00433-6 ↗
45. 10.1016/j.snb.2004.05.00710.1016/j.snb.2004.05.007 ↗
46. 10.1021/cm030308010.1021/cm0303080 ↗
47. G. L.BenavidesandP. C.Galambos “Electro‐Microfluidic Packaging ”SAND2002‐1941 unlimited release June 2002 Sandia National Laboratories (http://www.ntis.gov/ordering.htm).10.2172/801005 ↗
48. G. L.Benavides P. C.Galambos J. A.Emerson K. A.Peterson R. K.Giunta D. L.Zamora andR. D.Watson “Packaging of Electro‐Microfluidic Devices ”U.S. Patent No. 6 548 895 April 15 2003.
49. P.Galambos G.Benavides M.Okandan andD.Hetherington “Precision Alignment Packaging for Microsystems with Multiple Fluid Connections ”Proceedings of the ASME IMECE Nov. 11–16 2001 New York 1–8.10.1115/IMECE2001/MEMS-23902 ↗
50. First Reliability Test of a Surface Micromachined Microengine Using SHIMMeR
51. E.Amaya “Designing with Heralock™ 2000 Self‐Constrained LTCC Tape ”Technical Presentations IMAPS ATW: Ceramic Applications Microwave and Photonic Packaging Providence RI May 2–3 2002.
52. Patent pending.
53. K.Patel K.Hukari andK.Peterson “Low‐Temperature Cofired Ceramic Substrate Technology for Microfluidic Systems: Development of a High‐Temperature Ceram‐Ic Lyser for Solubilizing Spores ”Conference on MicroScale BioSeparations February 13–17 2005 New Orleans LA.
54. S. J.Kim Y. G.Lee S. K.Yun andH. Y.Lee “Realization of High‐Q Inductors Using Wirebonding Technology ”Proceedings of AP‐ASIC 13–16 1999.
55. A Horizontally Integrated Micromachined Filter
56. 10.1016/S0955-2219(01)00157-110.1016/S0955-2219(01)00157-1 ↗
57. 10.1007/s00170005001710.1007/s001700050017 ↗