Residual thermal stress of SiC/Ti 3 SiC 2 /SiC joints calculation and relaxed by postannealing
Source abstract
Abstract
Abstract Residual thermal stresses in SiC/Ti 3 SiC 2 /SiC joining couples were calculated by Raman spectra and simulated by finite element analysis, and then relaxed successfully by postannealing. The results showed that the thermal residual stress between Ti 3 SiC 2 and SiC was about on the order of 1 GP a when cooling from 1300°C to 25°C. The thermal residual stresses can be relaxed by the recovery of structure disorders during postannealing. When the SiC/Ti 3 SiC 2 /SiC joints postannealed at 900°C, the bending strength reached 156.9 ± 13.5 MP a, which was almost twice of the as‐obtained SiC/Ti 3 SiC 2 /SiC joints. Furthermore, the failure occurred at the SiC matrix suggested that both the flexural strength of joining layer and interface were higher than the SiC matrix.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Advanced ceramic materials synthesis · MXene and MAX Phase Materials · Advanced materials and composites
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Engineering Laboratory of Specialty Fibers and Nuclear Energy Materials (FiNE) Ningbo Institute of Materials Technology and Engineering Chinese Academy of Sciences Ningbo China
School of Materials Science and Engineering Yeungnam University Gyeongsan Korea
Department of Aeronautics and Astronautics Institute of Mechanics and Computational Engineering Fudan University Shanghai China
Funding
Natural Science Foundation of Zhejiang Province · National Natural Science Foundation of China · Chinese Academy of Sciences
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