Research on the influence mechanism and modification technology of UV-curing adhesive on the HPLD thermal-induced misalignment
Source abstract
Abstract
The demand for output performance and reliability of the HPLD (high-power laser diode) has become increasingly stringent with the development of application requirements. The thermal effect of the HPLD will lead to optical components` thermal-induced misalignment, which will significantly affect the output quality and power of the laser. In this paper, the influence of the thickness and uniformity of UV-curing adhesive on the thermal-induced misalignment of the bonding module is revealed. Then the thermal stability of UV-curing adhesive is optimized by the microparticles composite modification method. Finally, the single emitter array laser is packaged with the optimized modified UV-curing adhesive, the thermal-induced misalignment of beam-shaping components can be reduced by 8 times, and the power reduction ratio of the laser is reduced from 3.8% to 0.72%. This research supports efficient control of the thermal-induced misalignment which to ensures high-performance packaging and manufacturing for HPLD.
Source: expertdata · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Advanced optical system design · Photopolymerization techniques and applications · Laser Material Processing Techniques
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (25)
Show source-provided references
1. Military technology: laser weapons get real [J]10.1038/521408a ↗
2. Manufacturing with novel high-power diode lasers [J]10.1109/2944.883386 ↗
3. Mid-infrared III–V semiconductor lasers epitaxially grown on Si substrates
4. Review of issues and solutions in high-power semiconductor laser packaging technology[J]10.3389/fphy.2021.669591 ↗
5. Liu · 2015 · 107
6. Influence of positioning errors of optical shaping components for single emitter laser diode on beam shaping effects[J]10.1007/s11771-019-4215-3 ↗
7. Kasunic · 2015 · 58
8. Analysis influence of fiber alignment error on laser–diode fiber coupling efficiency[J]10.1016/j.ijleo.2015.11.219 ↗
9. Research on the influence of alignment error on coupling efficiency and beam quality for Gaussian beam to multimode fiber[J]10.1016/j.rinp.2018.12.071 ↗
10. Influence of positioning errors on the coupling efficiency of a single emitter laser array[J]10.1016/j.ijleo.2019.163949 ↗
11. Research on the influence of laser thermal characteristics on misalignment of optical components[J]10.1016/j.ijleo.2021.166907 ↗
12. Determination of volumetric shrinkage of thermally cured thermosets using video-imaging[J]10.1016/j.polymertesting.2015.11.014 ↗
13. Fast curing velocity, low volume shrinkage and high heat resistance achieved in novel ultraviolet curing adhesives[J]10.1088/2053-1591/aacd9b ↗
14. Adhesive bonding in microelectronics and photonics[J]10.1063/1.1467950 ↗
15. Experimental evaluation method of curing condition and shrinkage for UV curing adhesive [J]
16. A comprehensive investigation of acrylates photopolymerization shrinkage stress from micro and macro perspectives by real time MIR-photo-rheology[J]10.1016/j.porgcoat.2021.106229 ↗
17. Effect of monomer structure on real‐time UV‐curing shrinkage studied by a laser scanning approach[J]10.1002/adv.21331 ↗
18. Reducing volumetric shrinkage of photopolymerizable materials using reversible disulfide-bond reactions[J]10.1007/s10853-018-2778-2 ↗
19. Optimization and characterization of UV-curable adhesives for optical communications by response surface methodology[J]10.1016/S0142-9418(03)00038-2 ↗
20. Fabrication of UV-curable solvent-free epoxy modified silicone resin coating with high transparency and low volume shrinkage [J]10.1016/j.porgcoat.2019.01.005 ↗
21. Thermomechanical issues of high power laser diode catastrophic optical damage[J]10.1088/1361-6463/ab243f ↗
22. Curing behavior and viscoelasticity of dual-curable adhesives based on high-reactivity azo initiator[J]10.1007/s11664-016-4496-3 ↗
23. Design of highly adhesive and water-resistant UV/heat dual-curable epoxy–acrylate composite for narrow bezel display based on reactive organic–inorganic hybrid nanoparticles[J]10.3390/polym12102178 ↗
24. Volume change and viscoelastic properties of UV-curable adhesives for precise positioning during curing process and their formulation[J]
25. Fibre composite repair of cracked metallic aircraft components — practical and basic aspects[J]10.1016/0010-4361(87)90293-X ↗