The effects of partial bonding in load carrying capacity of single lap joints
Source abstract
Abstract
Abstract The effects of the presence and size of gaps in the band single lap joint geometry were studied. Two types of adhesives: a deformable, acrylic tape and epoxy putty were used as model adhesives. When using the epoxy putty, the substrate overlap end conditions were also varied by machining 10° end tapers in some joints. For both adhesive types, the introduction of the gap had a moderate negative effect on the load carrying characteristics of the joint, but joints utilizing the epoxy putty maintained joint strength as the gap size was increased to 9.53 mm (38% gap), while the highly deformable acrylic tape case displayed a constant decline and maintaining constant ultimate shear stress values. We suspect that this variation is due to a combination of the different failure modes of each adhesive and their differing moduli, as well as how these relate to the peeling stresses at the ends of the bond length. In the epoxy putty series, the samples with tapered substrates consistently carried higher loads than those with unmodified substrates. This improvement is a manifestation of the ability of the tapered joint geometry to reduce peeling stresses experienced within the adhesive layer.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Mechanical Behavior of Composites · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (13)
Show source-provided references
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