Mode I fracturing properties of epoxy bonding paste
Source abstract
Abstract
Abstract The wedge-splitting method by Tschegg was applied for the investigation of mode I fracture behavior of epoxy-based adhesives. Specific fracture energy and notch tensile strength of “traditional” thickened laminating resin were measured between −40 and +45 °C and compared to those of four new trial compounds. The adhesives in bulk were investigated as well as the interfaces between these adhesives and glass fiber-reinforced plastic. The wedge-splitting method has turned out suitable for epoxy resin. The quality of thickened laminating resin was not reached by the new trial compounds. Adherend pre-treatment with laminating resin and peel ply improved interfacial properties.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Mechanical Behavior of Composites · Epoxy Resin Curing Processes · Material Properties and Processing
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References (21)
Show source-provided references
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