journal article·2008-08Open access

Corrigendum to “Application of single pan thermal analysis to Cu–Sn peritectic alloys” [Acta Mater 56 (2008) 1519–1528]

F. Kohler, T. Campanella, S. Nakanishi, M. Rappaz

Acta Materialia· Volume 56· Issue 14

Abstract

In this article, SPTA curves were analyzed with the help of the Brody–Flemings [1] microsegregation model. However, this model does not conserve solute in the solid phase and is limited to small Fourier numbers (Lever rule is recovered for Fos = 0.5 instead of Fos = 1). In our article, the calculated value of Fos was 1.411 and this value was unfortunately used in the coupling with thermophysical data. While the heat flow model presented is still valid, a corrected analysis is presented here using Ohnaka’s model [2]. By enforcing a solute balance over the solid and liquid phases and assuming a parabolic distribution of concentration in the solid phase, Ohnaka [2] showed that the composition of the liquid phase, Cl, is given for a linearized phase diagram by
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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Solidification and crystal growth phenomena

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References (2)

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1. Solute redistribution in dendritic solidification
2. Mathematical analysis of solute redistribution during solidification with diffusion in the solid phase10.2355/isijinternational1966.26.1045 ↗