journal article·2010-06

First-principle study on substitution of Cu or P into Ni–Sn intermetallic compounds

T.J. Chung, W.H. Moon, Y.G. Park, M.C. Kim, C.K. Choi

Intermetallics· Volume 18· Issue 6
Publisher page

Abstract

Abstract The effect on substitution of Cu or P into the Ni–Sn intermetallic compound (IMC) is examined by analyzing the electronic structure based on first-principle calculation. When the Cu atom is substituted for the Ni one in Ni 3 Sn 2 , the resulting Ni–Cu–Sn IMC was energetically unstable, and then it had the higher electrical conductivity by the light electron effective mass. Meanwhile, when the P atom is replaced by the Sn one, the Ni–Sn–P IMC had the higher bulk modulus by the strong p–d hybridization between Ni and Sn or P, and also its electrical conductivity is lessen by the heavy electron effective mass.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Semiconductor materials and interfaces · Intermetallics and Advanced Alloy Properties

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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