The growth of intermetallic compound in Cu/Sn3.5Ag/Au solder joints under current stressing
Source abstract
Abstract
Abstract In this study, the interfacial reactions and polarity effect on intermetallic compounds (IMCs) formation of the Cu/Sn3.5Ag/Au solder joints were investigated under 100 °C, 2.6 × 103 A/cm2 of current stressing. With electron flow from the Cu toward the Au, both Sn and Cu atoms migrated from the cathode to the anode, these phenomena also accompanied with the crack formation at the (Cu,Au)6Sn5/solder interface and the rapid dissolution of Cu consumed. The sequence of Au–Sn IMCs formed at the Au side upon electromigration (EM) is AuSn4/AuSn2/AuSn/Au5Sn while as AuSn4/AuSn2/AuSn for aging. At cathodic Au side, the voids were formed in the AuSn4 and at the AuSn4/solder interface due to the migration of Sn toward the anode. The voids formation in AuSn on both cathode and anode sides is due to the consumption of Sn by transformation of AuSn into Au5Sn.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (31)
Show source-provided references
1. On the mechanism of the mobility of ions in metals
2. Electromigration in ULSI interconnects10.1016/j.mser.2007.04.002 ↗
3. Electromigration–a brief survey and some recent results10.1109/T-ED.1969.16754 ↗
4. Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions10.1016/j.scriptamat.2006.12.031 ↗
5. Interfacial metallurgical reaction between small flip-chip Sn/Au bumps and thin Au/TiW metallization under multiple reflow10.1016/j.scriptamat.2007.11.020 ↗
6. Massalski · 1986
7. Interfacial reactions between lead-free solders and common base materials10.1016/j.mser.2005.03.001 ↗
8. Room temperature interfacial reactions in electrodeposited Au/Sn couples10.1016/j.actamat.2008.08.002 ↗
9. Interdiffusion and phase formation at room temperature in evaporated gold–tin films10.1016/0040-6090(77)90356-X ↗
10. Room temperature interdiffusion in evaporated Au–Sn films10.1088/0031-8949/18/6/010 ↗
11. A study of evaporated gold–tin films using transmission electron microscopy: II10.1016/0040-6090(80)90292-8 ↗
12. A study of evaporated gold–tin films using transmission electron microscopy10.1016/0040-6090(80)90258-8 ↗
13. High-power AlGaInN flip-chip light-emitting diodes10.1063/1.1374499 ↗
14. Cross-interaction between Au and Cu in Au/Sn/Cu ternary diffusion couples10.1007/BF02692458 ↗
15. Effect of isothermal aging on intermetallic compounds and kirkendall void growth kinetics of Au stud bumps10.1007/s12540-009-0819-0 ↗
16. Interfacial reactions in Au/Sn/Cu sandwich specimens10.1016/j.intermet.2009.11.003 ↗
17. Cross-interaction between Au/Sn and Cu/Sn interfacial reactions10.1007/s11664-009-0920-2 ↗
18. Microstructure characterization of Sn–Ag solder joints between stud bumps and metal pads10.1007/s11664-003-0114-2 ↗
19. Electromigration behavior of the Cu/Au/SnAgCu/Cu solder combination10.1557/JMR.2008.0036 ↗
20. The difference in the types of intermetallic compound formed between the cathode and anode of an Sn–Ag–Cu solder joint under current stressing10.1016/j.intermet.2009.05.014 ↗
21. The growth of Sn whiskers with dislocation inclusion upon electromigration through a Cu/Sn3.5Ag/Au solder joint10.1016/j.scriptamat.2009.02.061 ↗
22. Study of electromigration-induced Cu consumption in the flip-chip Sn/Cu solder bumps10.1063/1.2357860 ↗
23. Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints10.1063/1.2359135 ↗
24. Investigation of diffusion and electromigration parameters for Cu–Sn intermetallic compounds in Pb-free solders using simulated annealing10.1016/j.actamat.2006.12.019 ↗
25. Electromigration of eutectic SnPb solder interconnects for flip chip technology10.1063/1.1342023 ↗
26. Electromigration of eutectic SnPb and SnAg3.8Cu0.7 flip chip solder bumps and under-bump metallization10.1063/1.1400096 ↗
27. Shewmon · 1989
28. Room temperature interdiffusion studies of Au/Sn thin film couples10.1016/0040-6090(81)90468-5 ↗
29. A diffusion marker in Au/Sn thin films10.1016/0040-6090(81)90420-X ↗
30. Intermetallic growth and kirkendall effect manifestations in Cu/Sn and Au/Sn diffusion couples
31. Interdiffusion study in binary gold–tin system10.1016/j.intermet.2010.07.013 ↗