Characterization of the interfacial-microstructure evolution and void shrinkage of Ti-22Al-25Nb orthorhombic alloy with different surface roughness during diffusion bonding

Abstract Ti-22Al-25Nb alloy specimens with different surface roughness were joined, through diffusion bonding at 975 °C at 12.5 MPa. The interfacial-microstructure evolution during this process was characterized via scanning electron microscopy combined with electron probe microanalysis and electron backscatter diffraction analysis. Further, the interfacial void-shrinkage mechanism and the quality of the bonded joints were determined through atomic force microscopy, which revealed the three-dimensional morphologies of the surfaces, and shear strength testing of the joints. The results revealed that fine equiaxed α2 grains are precipitated in the bonding interface of specimens with ground surfaces. These interfacial α2 grains were formed via phase transformation and recrystallization processes, which were triggered by asperity deformation at the contact plane and unavoidable oxygen contamination. Two types of fracture occurred during the shear strength tests, where the bonds generated from (i) polished surfaces failed predominantly along the bond line, and (ii) ground surfaces failed predominantly in the base material away from the bond line. This indicated that the mechanism controlling the void-shrinkage process associated with the contact between two rough surfaces during diffusion bonding varied with the surface roughness: the void-shrinkage process of specimens with (i) polished surfaces is controlled by diffusion, and (ii) ground surfaces was controlled by both diffusion and plastic deformation.