Effect of Thermal via Design on Heat Dissipation of High-Lead QFN Packages Mounted on PCB
Source abstract
Abstract
The quad flat no-lead package (QFN) is widely used in integrated circuits due to its advantages in performance and cost. With the increasing power of electronic products, effective heat dissipation from QFN packages has become crucial to prevent product damage. The focus of this study is to investigate the thermal performance of QFN packages soldered onto printed circuit boards (PCB) by finite element analysis (FEA). Conventional QFN, dual-row QFN, and high-lead QFN packages were modeled and compared by ANSYSY software. The effect of thermal via design (the distance, number, distribution, diameter, and thickness of thermal vias) on the QFN package was investigated. The study revealed that the high-lead QFN package consistently demonstrated superior heat dissipation performance than the other two under different conditions. Placing thermal vias closer to the heat source enhances heat dissipation efficiency. Thermal vias positioned beneath the thermal pad were particularly effective. Increasing thermal via quantity and diameter improved heat dissipation, with square distribution layouts showing advantages. However, excessive copper plating thickness can increase thermal resistance and hinder heat dissipation.
Source: crossref · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Silicon Carbide Semiconductor Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
SJTU-Zhongmu Joint Research Center for Materials and Technology of Intelligent and Connected Vehicles, Institute of Electronic Materials and Technology, School of Materials Science and Engineering, Shanghai Jiao Tong University, Shanghai 200240, China
Funding
SJTU-Zhongmu Joint Research Center for Materials and Technology of Intelligent and Connected Vehicles · Suzhou Aeroton Technology Co. Ltd.
References (27)
Show source-provided references
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