Thermal Expansion of Ni3S2 in Ni3S2-Ni Alloys
Source abstract
Abstract
The thermal expansion of nickel sulfide in Ni3S2-Ni alloys (a sample synthesized in this work and a commercial Ni3S2-Ni-Cu9S5 converter matte) is measured using high-temperature x-ray diffraction. The best fit equations are derived for the temperature-dependent (≤980 K) parameters of the rhombohedral (hexagonal) and cubic cells of nickel sulfide, and the thermal expansion coefficients of Ni3S2 are determined. The results demonstrate that the thermal expansion of Ni3S2 is influenced by impurity phases: Ni metal and Cu9S5. The chemical strain arising from the dissolution of the copper sulfide in Ni3S2 cancels out the shear strain near the polymorphic transformation.
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Research context
OpenAlex topics: Chalcogenide Semiconductor Thin Films · nanoparticles nucleation surface interactions · Phase-change materials and chalcogenides
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References (13)
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