Architecture and Process Integration Overview of 3D NAND Flash Technologies
Source abstract
Abstract
In the past few decades, NAND flash memory has been one of the most successful nonvolatile storage technologies, and it is commonly used in electronic devices because of its high scalability and reliable switching properties. To overcome the scaling limit of planar NAND flash arrays, various three-dimensional (3D) architectures of NAND flash memory and their process integration methods have been investigated in both industry and academia and adopted in commercial mass production. In this paper, 3D NAND flash technologies are reviewed in terms of their architecture and fabrication methods, and the advantages and disadvantages of the architectures are compared.
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Research context
OpenAlex topics: Advanced Data Storage Technologies · Advanced Memory and Neural Computing · Cellular Automata and Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Electronic Engineering, Inha University, Incheon 22212, Korea
Department of Electrical and Computer Engineering, Seoul National University, Seoul 08826, Korea
Funding
National Research Foundation of Korea
References (77)
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