Inverse Design for Silicon Photonics: From Iterative Optimization Algorithms to Deep Neural Networks
Source abstract
Abstract
Silicon photonics is a low-cost and versatile platform for various applications. For design of silicon photonic devices, the light-material interaction within its complex subwavelength geometry is difficult to investigate analytically and therefore numerical simulations are majorly adopted. To make the design process more time-efficient and to improve the device performance to its physical limits, various methods have been proposed over the past few years to manipulate the geometries of silicon platform for specific applications. In this review paper, we summarize the design methodologies for silicon photonics including iterative optimization algorithms and deep neural networks. In case of iterative optimization methods, we discuss them in different scenarios in the sequence of increased degrees of freedom: empirical structure, QR-code like structure and irregular structure. We also review inverse design approaches assisted by deep neural networks, which generate multiple devices with similar structure much faster than iterative optimization methods and are thus suitable in situations where piles of optical components are needed. Finally, the applications of inverse design methodology in optical neural networks are also discussed. This review intends to provide the readers with the suggestion for the most suitable design methodology for a specific scenario.
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Research context
OpenAlex topics: Photonic and Optical Devices · Neural Networks and Reservoir Computing · Optical Network Technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Tsinghua-Berkeley Shenzhen Institute, Tsinghua University, Shenzhen 518055, China
Tsinghua Shenzhen International Graduate School, Tsinghua University, Shenzhen 518055, China
School of Electronic and Computer Engineering, Peking University, Shenzhen 518055, China
Funding
Shenzhen Science and Technology Innovation Commission
References (100+)
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