Effect of Nanoparticles Addition on the Microstructure and Properties of Lead-Free Solders: A Review
Source abstract
Abstract
With the development of microelectronic packaging and increasingly specific service environment of solder joints, much stricter requirements have been placed on the properties of lead-free solders. On account of small size effect and high surface energy, nanoparticles have been widely used to improve the microstructure and properties of lead-free solders. Therefore, the composite solders bearing nanoparticles have recently attracted wide attention. This article reviewed the recent research on SnAgCu, SnBi, and SnZn composite solder alloys and introduced the effect of nanoparticles on their microstructure, mechanical properties, wettability, and reliability. The mechanism of nanoparticles strengthening was analyzed and summarized. In addition, the shortcomings and future development trends of nanoparticle-reinforced lead-free solders were discussed, which is expected to provide some theoretical reference for the application of these composite solder in 3D IC package.
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Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
School of Materials Science and Engineering, Nanjing University of Science and Technology, Nanjing 210096, China
State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering Co., Ltd., Zhengzhou 450002, China
Funding
The National Natural Science Foundation of China · The Priority Academic Program Development of Jiangsu Higher Education Institutions
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