journal article·2017-11-28Open access

Evaluation and Optimization of a Hybrid Manufacturing Process Combining Wire Arc Additive Manufacturing with Milling for the Fabrication of Stiffened Panels

Fang Li, Shujun Chen, Junbiao Shi, Hongyu Tian, Yun Zhao

Applied Sciences· Volume 7· Issue 12

Abstract

This paper proposes a hybrid WAAM (wire arc additive manufacturing) and milling process (HWMP), and highlights its application in the fabrication of stiffened panels that have wide applications in aviation, aerospace, and automotive industries, etc. due to their light weight and strong load-bearing capability. In contrast to existing joining or machining methods, HWMP only deposits stiffeners layer-by-layer onto an existing thin plate, followed by minor milling of the irregular surfaces, which provides the possibility to significantly improve material utilization and efficiency without any loss of surface quality. In this paper, the key performances of HWMP in terms of surface quality, material utilization and efficiency are evaluated systematically, which are the results of the comprehensive effects of the deposition parameters (e.g., travel speed, wire-feed rate) and the milling parameters (e.g., spindle speed, tool-feed rate). In order to maximize its performances, the optimization is also performed to find the best combination of the deposition and the milling parameters. The case study shows that HWMP with the optimal process parameters improves the material utilization by 57% and the efficiency by 32% compared against the traditional machining method. Thus, HWMP is believed to be a more environmental friendly and sustainable method for the fabrication of stiffened panels or other similar structures.
Source: crossref · Quality: baseline

Research context

OpenAlex topics: Additive Manufacturing Materials and Processes · Additive Manufacturing and 3D Printing Technologies · Advanced Machining and Optimization Techniques

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

Funding

National Natural Science Foundation of China · China Postdoctoral Science Foundation funded project

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