Effect of additions Sb, In, and Zn on the thermal behavior, microstructure, and tensile properties of Sn-2.5Ag-0.8Cu solder alloy
Bibliographic record
Abstract
No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.
Source: Not provided · Quality: missing
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties · Advanced Welding Techniques Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (31)
Show source-provided references
1. 1. Abtew, M. and G. Selvaduray, Lead-free solders in microelectronics. Materials Science and Engineering: R: Reports, 2000. 27(5–6): p. 95–141.10.1016/S0927-796X(00)00010-3 ↗
2. 2. Shnawah, D.A., et al., High-reliability low-Ag-content Sn-Ag-Cu solder joints for electronics applications. Journal of electronic materials, 2012. 41(9): p. 2631–2658.10.1007/s11664-012-2145-z ↗
3. 3. Wu, J., et al., Recent progress of Sn–Ag–Cu lead-free solders bearing alloy elements and nanoparticles in electronic packaging. Journal of Materials Science: Materials in Electronics, 2016. 27(12): p. 12729–12763.10.1007/s10854-016-5407-3 ↗
4. A. Kaushal, M.R. Kumar, Effects of Zn addition on electrochemical behavior of Sn-5Sb-xZn lead-free solder alloy in 3.5 wt.% NaCl solution. J. Mater. Eng. Perform. (2025). https://doi.org/10.1007/s11665-025-12269-010.1007/s11665-025-12269-0 ↗
5. 5. Eid, E., et al., Microstructural Examination and Thermodynamic Analysis of Sn-1.5 Ag-0.5 Cu-x mass% Ni Lead-Free Solder Alloys. Journal of Thermal Analysis and Calorimetry, 2024. 149(10): p. 4313–4331.10.1007/s10973-024-13018-6 ↗
6. 6. Eid, E., et al., The role of Ni minor additions on the mechanical characteristics of Sn-1.5 Ag-0.5 wt.% Cu (SAC155) Pb-free solder alloy. Journal of Materials Science: Materials in Electronics, 2024. 35(32): p. 2092.10.1007/s10854-024-13876-8 ↗
7. 7. El Basaty, A., A. Deghady, and E. Eid, Influence of small addition of antimony (Sb) on thermal behavior, microstructural and tensile properties of Sn-9.0 Zn-0.5 Al Pb-free solder alloy. Materials Science and Engineering: A, 2017. 701: p. 245–253.10.1016/j.msea.2017.06.092 ↗
8. 8. Xu, F., et al., Effect of Sb content on the phase structure and interface structure of Sn1. 0Ag0. 5Cu lead-free solder. Microelectronics Reliability, 2023. 140: p. 114883.10.1016/j.microrel.2022.114883 ↗
9. 9. Fazal, M., et al., A critical review on performance, microstructure and corrosion resistance of Pb-free solders. Measurement, 2019. 134: p. 897–907.10.1016/j.measurement.2018.12.051 ↗
10. A. El-Daly, A. El-Taher, Improved strength of Ni and Zn-doped Sn–2.0 Ag–0.5 Cu lead-free solder alloys under controlled processing parameters. Mater. Des. 47, 607–614 (2013)10.1016/j.matdes.2012.12.081 ↗
11. Z.-H. Li et al., Influence of copper nanowires on properties and microstructure of low-Ag Sn-1Ag-0.5 Cu solders. J. Mater. Sci. Mater. Electron. 33(10), 7923–7932 (2022)10.1007/s10854-022-07941-3 ↗
12. L. Sun, L. Zhang, Properties and microstructures of Sn-Ag‐Cu‐X lead‐free solder joints in electronic packaging. Adv. Mater. Sci. Eng. 2015(1), 639028 (2015)
13. 13. Kotadia, H.R., et al., Identification of the Role of Zinc in Sn–Cu Solder and Interfacial Intermetallic Growth Through Experimental Results and Phase-Field Simulations. Available at SSRN 5090471.
14. J. Yan et al., The thermal reliability of indium-doped low solver SAC/Cu joints and the corresponding alloys. Adv. Compos. Hybrid Mater. 8(2), 1–21 (2025)10.1007/s42114-025-01236-x ↗
15. E. Eid, E. El-Khawas, A.S. Abd-Elrahman, Impact of Sb additives on solidification performance, microstructure enhancement and tensile characteristics of Sn-6.5 Zn-0.3 Cu Pb-free solder alloy. J. Mater. Sci. Mater. Electron. 30(7), 6507–6518 (2019)10.1007/s10854-019-00956-3 ↗
16. A. Fouda, E. Eid, Role of graphene oxide (GO) for enhancing the solidification rate and mechanical properties of Sn–6.5 Zn–0.4 wt% Cu Pb-free solder alloy. J. Mater. Sci. Mater. Electron. 33(1), 522–540 (2022)10.1007/s10854-021-07324-0 ↗
17. W. Xiao et al., Comparative study of microstructures and properties of three valuable SnAgCuRE lead-free solder alloys. J. Electron. Mater. 35(5), 1095–1103 (2006)10.1007/BF02692572 ↗
18. K. Suganuma et al., Heat resistance of Sn–9Zn solder/Cu interface with or without coating. J. Mater. Res. 15(4), 884–891 (2000)10.1557/JMR.2000.0126 ↗
19. C.-Y. Liu et al., Thermal behavior and microstructure of the intermetallic compounds formed at the Sn–3Ag–0.5 Cu/Cu interface after soldering and isothermal aging. J. Cryst. Growth 290(1), 103–110 (2006)10.1016/j.jcrysgro.2005.12.090 ↗
20. E. Bradley, J. Hranisavljevic, Characterization of the melting and wetting of Sn-Ag-X solders. IEEE Trans. Electron. Packag. Manuf. 24(4), 255–260 (2001)10.1109/6104.980033 ↗
21. H. Yoshioka, Y. Tada, Y. Hayashi, Crystal growth and its morphology in the mushy zone. Acta Mater. 52(6), 1515–1523 (2004)10.1016/j.actamat.2003.11.033 ↗
22. L. Snugovsky et al., The solid solubility of Ag and Cu in the Sn phase of eutectic and near-eutectic Sn-Ag-Cu solder alloys. J. Electron. Mater. 33(11), 1313–1315 (2004)10.1007/s11664-004-0159-x ↗
23. K. Kim, S. Huh, K. Suganuma, Effects of cooling speed on microstructure and tensile properties of Sn–Ag–Cu alloys. Mater. Sci. Eng. A 333(1–2), 106–114 (2002)10.1016/S0921-5093(01)01828-7 ↗
24. B. Chen, G. Li, Influence of Sb on IMC growth in Sn–Ag–Cu–Sb Pb-free solder joints in reflow process. Thin Solid Films 462, 395–401 (2004)10.1016/j.tsf.2004.05.063 ↗
25. T.-M. Korhonen, J. Kivilahti, Thermodynamics of the Sn-In-Ag solder system. J. Electron. Mater. 27(3), 149–158 (1998)10.1007/s11664-998-0205-1 ↗
26. S.K. Kang et al., Controlling Ag3Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying. JOM 56(6), 34–38 (2004)10.1007/s11837-004-0108-4 ↗
27. S.K. Kang et al., Interfacial reactions of Sn-Ag-Cu solders modified by minor Zn alloying addition. J. Electron. Mater. 35(3), 479–485 (2006)10.1007/BF02690535 ↗
28. C.C. de Carvalho et al., Effects of different zinc content on solidification, microstructure, and mechanical properties in tin–bismuth alloy. Adv. Eng. Mater. 26(21), 2401074 (2024)10.1002/adem.202401074 ↗
29. M.A. Gharaibeh, F.M. Al-Oqla, Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents. Sold. Surf. Mount Technol. 35(5), 319–330 (2023)10.1108/SSMT-07-2023-0036 ↗
30. X. Long et al., An insight into dynamic properties of SAC305 lead-free solder under high strain rates and high temperatures. Int. J. Impact Eng. 175, 104542 (2023)10.1016/j.ijimpeng.2023.104542 ↗
31. A. Fouda, E. Eid, Influence of ZnO nano-particles addition on thermal analysis, microstructure evolution and tensile behavior of Sn–5.0 wt% Sb–0.5 wt% Cu lead-free solder alloy. Mater. Sci. Eng. A 632, 82–87 (2015)10.1016/j.msea.2015.02.070 ↗