journal article·2025-05

Effect of annealing on resistivity of Cu and CuAl metallization

Yeomin Yoon, Sangwoo Kim, Sanghun Kim, Jeonghun Yang, Dong Hun Kim

Applied Physics A· Volume 131· Issue 5
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Abstract

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OpenAlex topics: Copper Interconnects and Reliability · Electronic Packaging and Soldering Technologies · Aluminum Alloys Composites Properties

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References (27)

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