Crack-free processing of glasses by 1 μm-YAG laser and translucent adhesive tape and its numerical analyses by CIP
Source abstract
Abstract
We succeeded in drilling a crack-free high-aspect-ratio hole through glass with a YAG laser of 1 μm wavelength, 5 ns pulse width and 30–630 mJ energies. The hole is 25.5 mm long with 500 μm radius, and no crack is observed even in atmospheric condition. This success is due to the translucent adhesive tape pasted on glass surface in which the temperature is controlled and thermal stress is reduced. Computer simulation revealed the occurring phenomena.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Laser Material Processing Techniques · Solid State Laser Technologies · Ocular and Laser Science Research
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References (7)
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