DataVXApplied Physics A: Materials Science & ProcessingPaper
journal article·1995-07-01

Multiple internal reflection spectroscopy of bonded silicon wafers

M. Reiche, S. Hopfe, U. G�sele, Q. Y. Tong

Applied Physics A: Materials Science & Processing· Volume 61· Issue 2
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Research context

OpenAlex topics: 3D IC and TSV technologies · Silicon and Solar Cell Technologies · Electronic Packaging and Soldering Technologies

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