journal article·2009-01Open access

Erratum to Crackless linear through-wafer etching of Pyrex glass using liquid-assisted CO2 laser processing

C. K. Chung, Y. C. Sung, G. R. Huang, E. J. Hsiao, W. H. Lin, S. L. Lin

Applied Physics A· Volume 94· Issue 1

Abstract

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Research context

OpenAlex topics: Advanced Surface Polishing Techniques · Laser Material Processing Techniques · Thin-Film Transistor Technologies

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References

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