Variations in thermoelectric power of thin monocrystalline films with conductivity

journal article·1980-12

C. R. Tellier, A. J. Tosser, L. Hafid

Applied Physics· Volume 23· Issue 4

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OpenAlex topics: Copper Interconnects and Reliability · Electronic Packaging and Soldering Technologies · Metal and Thin Film Mechanics

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1. C. R. Tellier, L. Hafid, A.J. Tosser: Rev. Phys. Appl. (1980), to be published

2. C.R. Tellier, A.J. Tosser: Thin Solid Films70, 225–234 (1980)10.1016/0040-6090(80)90362-4 ↗

3. C.R. Pichard, C.R. Tellier, A.J. Tosser: Thin Solic Films62, 189 (1979)10.1016/0040-6090(79)90305-5 ↗

4. C.R. Tellier, C.R. Pichard, A.J. Tosser: Vide196S, 93 (1979)

5. A.F. Mayadas, M. Shatzkes: Phys. Rev. B1, 1382 (1970)10.1103/PhysRevB.1.1382 ↗

6. E.E. Mola, J.M. Heras: Electrocomp. Sci. Technol1, 77 (1974)10.1155/APEC.1.77 ↗

7. E.E. Mola, J.M. Heras: Thin Solid Films18, 137 (1973)10.1016/0040-6090(73)90231-9 ↗

8. C.R. Tellier, A.J. Tosser: Thin Solid Films41, 161 (1977)10.1016/0040-6090(77)90399-6 ↗

9. E.M. Ziman: Electron and Phonons (Clarendon Press Oxford 1962)

10. V.V. Narasimha Rao, S. Mohan, P.J. Reddy: Thin Solid Films42, 283 (1977)10.1016/0040-6090(77)90364-9 ↗

11. V.V. Narasimha Rao, S. Mohan, P. Jayarama, P.J. Reddy: J. Phys. D (Appl. Phys.)9, 89 (1976)10.1088/0022-3727/9/1/015 ↗

12. See, for example, K. L. Chopra:Thin Film Phenomena, (McGraw-Hill, New York) 1969 Chap. VI

13. P.M. Hall: Appl. Phys. Lett.12, 212 (1968)10.1063/1.1651956 ↗