Impact of process factors on the performance of hole array metallic filters
Source abstract
Abstract
In this work, we evaluate through rigorous coupled-wave analysis simulations the effect of various process-related inaccuracies on plasmonic filters performance, especially regarding cross-shaped-hole arrays. Focusing exclusively on CMOS-compatible materials, we demonstrate the potential of these structures for reliable integration and fabrication at wafer level. A high monitoring of the deposition parameters is required to control the transmission level and the resonant wavelength of the filters. Optical proximity calculations show that double patterning is a way to limit corner rounding and to avoid losing the resonant mode of the crosses. The impacts on plasmon resonances of the metal oxidation, or a sloped profile after metal etching, are evaluated. These results allow for a good anticipation regarding process issues to realize efficient plasmonic filters.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Plasmonic and Surface Plasmon Research · Optical Coatings and Gratings · Photonic Crystals and Applications
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
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