journal article·2021-03

Atmospheric plasma irradiation for surface modification of Cu-TiC thin film

Avishek Roy, Nayan Ghosh, Manojit Ghosh, Sadhan Chandra Das, Abhijit Majumdar

Applied Physics A· Volume 127· Issue 3
Publisher page

Abstract

The challenges in the field of electrical conductive coatings have stimulated us to investigate the effects of atmospheric pressure plasma jet irradiation on a conductive film surface. We report the surface modifications of Cu-TiC thin film as a function of Ar plasma irradiation (up to 25 min). Cu-TiC thin film is synthesized by a modified sol–gel technique and deposited on quartz glass. A decrease in DC static resistance (~ 2kΩ to ~ 600Ω) and surface electrical resistivity (8.05–6.12) mΩ.m is observed post plasma irradiation. The enhancements of hydrophilicity and surface free energy (39.66–72.43) mN/M have been explored from the contact angle measurements. The particle agglomeration in surface topography as observed from the scanning electron microscopy images has major contributions in the increase of average surface roughness (~ 0.46 nm to ~ 7.6 nm) in the plasma treated films, as obtained from the atomic force microscopy analysis. The energy-dispersive X-ray spectroscopy analysis has revealed a uniform chemical homogeneity of the constituent elements throughout the surface, but oxygen weight % is reduced from 25 to 7% after plasma irradiation. The X-ray diffraction pattern and fast fourier transform analysis depict the polycrystalline structure of the films. We propose this technique for optimizing the conductive surface parameters of Cu-TiC films without disrupting the chemical modifications.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Copper Interconnects and Reliability · Metal and Thin Film Mechanics · Plasma Diagnostics and Applications

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References (70)

Show source-provided references
1. M. Laroussi, X. Lu, Appl. Phys. Lett. 87, 113902 (2005)10.1063/1.2045549 ↗
2. G. Bonizzoni, E. Vassallo, Vacuum 64(3–4), 327 (2002)10.1016/S0042-207X(01)00341-4 ↗
3. O.V. Penkov, M. Khadem, W.S. Lim, D.E. Kim, J Coat. Technol. Res 12, 225–235 (2015)10.1007/s11998-014-9638-z ↗
4. D.P. Dowling, F.T. O’Neill, S.J. Langlais, V.J. Law, Plasma Process. Polym. 8(8), 718–727 (2011)10.1002/ppap.201000145 ↗
5. E. Ionita, M. Ionita, E. Stancu, M. Teodorescu, G. Dinescu, Appl. Surf. Sci. 255(10), 5448–5452 (2009)10.1016/j.apsusc.2008.10.082 ↗
6. J. Ying, R. Chunsheng, Y. Liang, Z. Jialiang, W. Dezhen. Plasma Sci. Technol. 15(12), 1203–1208 (2013)10.1088/1009-0630/15/12/08 ↗
7. K. Fricke, H. Steffen, T. Woedtke, K. Schroder, K.D. Weltmann, Plasma Process. Polym. 8(1), 51–58 (2011)10.1002/ppap.201000093 ↗
8. S. Bornholdt, M. Wolter, H. Kersten, Eur. Phys. J. D 60, 653–660 (2010)10.1140/epjd/e2010-00245-x ↗
9. A. Zendehnam, J. Ghasemi, A. Zendehnam, Int Nano Lett 8, 157–164 (2018)10.1007/s40089-018-0240-8 ↗
10. R. Paneru, P. Lamichhane, B.C. Adhikari, S.H. Ki, J. Choi, J.S. Kwon, E. H. Choi. AIP Adv. 9, 075008 (2019)10.1063/1.5100776 ↗
11. M.H. Jung, H.S. Choi, J. Colloid, Int. Sci. 310(2), 550–558 (2007)
12. C.C. Wu, C.I. Wu, J.C. Sturm, A. Kahn, Appl. Phys. Lett. 70, 1348 (1997)10.1063/1.118575 ↗
13. S.K. So, W.K. Choi, C.H. Cheng, L.M. Leung, C.F. Kwong, Appl. Phys A 68, 450 (1999)10.1007/s003390050921 ↗
14. T. Kawashima, H. Matsui, N. Tanabe. Thin Solid Films 445, 241 (2003)10.1016/S0040-6090(03)01169-6 ↗
15. S.H. Jeong, J.H. Boo, Thin Solid Films 105, 447–448 (2004)
16. G. Beck, S. Barcikowski, V.S.K. Chakravadhanula, M. Comesaña-Hermo, M. Deng, M. Farle, M. Hilgendorff, J. Jakobi, J. Janek, L. Kienle, B. Mogwitz, T. Schubert, F. Stiemke, Thin Solid Films 595, 96 (2015)10.1016/j.tsf.2015.10.059 ↗
17. F. Wang, Y. Li, X. Wang, Y. Koizumi, Y. Kenta, A. Chiba, J. Alloy. Compd. 657 122e132 (2016).10.1016/j.jallcom.2015.10.061 ↗
18. S. Rathod, O.P. Modi, B.K. Prasad, A. Chrysanthou, D. Vallauri, V.P. Deshmukh, A.K. Shah, Mater. Sci. Eng. A 502, 91–98 (2009)10.1016/j.msea.2008.10.002 ↗
19. J. Zhuang, Y.B. Liu, Z.Y. Cao, Y.Y. Li, Mater. Trans. 51(12), 2311–2317 (2010)10.2320/matertrans.M2010270 ↗
20. V. Stranak, H. Wulff, P. Ksirova, C. Zietz, S. Drache, M. Cada, Z. Hubicka, R. Bader, M. Tichy, C.A. Helm, R. Hippler, Thin Solid Films 550, 389–394 (2014)10.1016/j.tsf.2013.11.001 ↗
21. A. Roy, S.C. Das, A. Majumdar Mater. Today Proc. “In Press” 2020. https://doi.org/10.1016/j.matpr.2020.08.55210.1016/j.matpr.2020.08.552 ↗
22. A. Roy, A.K. Mukhopadhyay, S.C. Das, G. Bhattacharjee, A. Majumdar, R. Hippler, Coatings 9(9), 551 (2019)10.3390/coatings9090551 ↗
23. A. Roy, S. Hembram, M. Ghosh, A. Majumdar, Mater. Res. Express 7, 036406 (2020)10.1088/2053-1591/ab7e49 ↗
24. A. Roy, A.K. Mukhopadhyay, M. Gupta, A. Majumdar, Bull Mater Sci. 43, 260 (2020)10.1007/s12034-020-02234-z ↗
25. C. Liu, N.M.D. Brown, B.J. Meenan, Appl. Surf. Sci. 252(6), 2297–2310 (2006)10.1016/j.apsusc.2005.04.016 ↗
26. S.K. Øiseth, A. Krozer, B. Kasemo, J. Lausmaa Appl. Surf. Sci. 202(1–2), 92–103 (2002)10.1016/S0169-4332(02)00928-5 ↗
27. M.H. Qaisrani, Y. Xian, C. Li, X. Pei, M. Ghasemi, X. Lu, Phys. Plasmas 23, 063523 (2016)10.1063/1.4954828 ↗
28. G.M. Xu, Y. Ma, G.J. Zhang, IEEE T Plasma Sci. 36, 4 (2008)10.1109/TPS.2008.929215 ↗
29. Q. Xiong, X.P. Lu, K. Ostrikov, Y. Xian, C. Zou, Z. Xiong, Y. Pan, Phys. Plasmas 17, 043506 (2010)10.1063/1.3381132 ↗
30. J. Park, J. Huh, S. Lee, J. Lee, W.H. Lee, K. Lim, Y.S. Kim, ACS Appl. Mater. Interfaces 10(36), 30581–30586 (2018)10.1021/acsami.8b11111 ↗
31. S.J. Oh, C.J. Han, J.W. Kim, Y.H. Kim, S.K. Park, J.I. Han, J.W. Kang, M.S. Oh, Electrochem. Solid-State Lett. 14, H354 (2011)10.1149/1.3597660 ↗
32. H.A. Karahan, E. Özdoğan. Fibers Polym 9, 21–26 (2008)10.1007/s12221-008-0004-6 ↗
33. Y. Zhou, Y. Yan, M. Shi, Y. Liu, Polymers 11, 8 (2019)10.3390/polym11010008 ↗
34. S. Kajita et al., Surf. Coat. Tech. 340, 86–92 (2018)10.1016/j.surfcoat.2018.02.026 ↗
35. K.X. Zhang, W. Wang, J.L. Hou, J.H. Zhao, Y. Zhang, Y.C. Fang, Vacuum 85, 990–993 (2011)10.1016/j.vacuum.2011.02.006 ↗
36. T. Sato, H. Akiyama, S. Horiuchi, T. Miyamae, Surf. Sci. 677, 93–98 (2018)10.1016/j.susc.2018.06.010 ↗
37. S.C. Das, A. Majumdar, S. Mukherjee, S. Katiyal, T. Shripathi IEEE Xplore 978–9, 3805–4421 (2016)
38. D. Mance, R. Wiese, T. Kewitz, H. Kersten, Eur. Phys. J. D 72, 98 (2018)10.1140/epjd/e2018-80768-8 ↗
39. T. Young, An essay on the cohesion of fluids. Philos. Trans. R. Soc. Lond. 1776–1886(95), 65–87 (1805)
40. F.M. Fowkes, Industrial, engineering. Chemistry 56, 12 (1964)
41. M. Żenkiewicz, J. Achiev. Mater. Manuf. Eng. 24, 1 (2007)
42. D.V. Krishnan, G.U. Kumar, S. Suresh, M. Jubal, M.R. Thansekhar, R. Ramesh, Int. J. Heat Mass Transfer 140, 886–896 (2019)10.1016/j.ijheatmasstransfer.2019.06.005 ↗
43. S. Mishra, N. Sridhara, A. Mitra, B. Yougandar, S.K. Dash, S. Agarwal, A. Dey, Opt Laser Eng 90, 128–138 (2017)10.1016/j.optlaseng.2016.10.007 ↗
44. L. Li, C. Liu, X. Zhang, G. Wu, M. Zhang, R.K.Y. Fu, P. K. Chu. Laser Part. Beams 32, 69–78 (2014)10.1017/S0263034613000888 ↗
45. D. Hwang, M. Misra, Y. Lee, S. Baek, J. Myoung, T. Lee. Appl. Surf. Sci. 405, 344–434 (2017)10.1016/j.apsusc.2017.02.007 ↗
46. J. Soldan, J. Musil Vacuum 81, 531–538 (2006)10.1016/j.vacuum.2006.07.013 ↗
47. S. Rasool, K. Saritha, K.T.R. Reddy, M.S. Tivanov, V.F. Gremenok, S.P. Zimin, A.S. Pipkova, L.A. Mazaletskiy, I.I. Amirov, Mater. Res. Express 7, 016431 (2020)10.1088/2053-1591/ab6a5b ↗
48. M. Baleva, E. Mateeva, J Mater Sci 31, 1213–1219 (1996)10.1007/BF00353100 ↗
49. T.Y. Chiang, C.L. Dai, D. M. Lian. J. Alloys Compd 509, 5623–5626 (2011)10.1016/j.jallcom.2011.02.093 ↗
50. A. Hojabri, F. Hajakbari, N. Soltanpoor, M.S. Hedayati, J. Theor. Appl. Phys. 8, 132 (2014)10.1007/s40094-014-0132-x ↗
51. P.M. Shafi, A.C. Bose, AIP Adv. 5, 057137 (2015)10.1063/1.4921452 ↗
52. J.H. Bang, H.S. Uhm, W. Kim, J.S. Park, Thin Solid Films 519, 1568–1572 (2010)10.1016/j.tsf.2010.08.088 ↗
53. D. Lee, J.K. Kim, J. Hao, H.K. Kim, J.S. Yoon, J.M. Lee, J Alloy Compd 583, 535–538 (2014)10.1016/j.jallcom.2013.09.008 ↗
54. T.M. Hammad, H.M. Tamous, Chin. J. Phys. 40, 5 (2002)
55. D.K. Owens, R.C. Wendt, J. Appl. Polym. Sci. 13, 1741–1747 (1969)10.1002/app.1969.070130815 ↗
56. S. Pelagade et al., J. Phys.: Conf. Ser. 208, 012107 (2010)
57. S. Tang, O. Kwon, N. Lu, H. Choi Korean J. Chem. Eng. 21(6), 1218-1223 (2004).10.1007/BF02719497 ↗
58. S.S. Shinde, A.P. Korade, C.H. Bhosale, K.Y. Rajpure, J. Alloys Compd. 551, 688–693 (2013)10.1016/j.jallcom.2012.11.057 ↗
59. P.S. Maldar, M.A. Gaikwad, A.A. Mane, S.S. Nikam, S.P. Desai, S.D. Giri, A. Sarkar, A.V. Moholkar, Sol. Energy 158, 89–99 (2017)10.1016/j.solener.2017.09.036 ↗
60. I. Takahashi, S. Joonwichien, S. Matsushima, N. Usami, J. Appl. Phys. 117, 095701 (2015)10.1063/1.4913855 ↗
61. Z.L. Liu, Z. Zhuang, X.M. Liu, X.C. Zhao, Z.H. Zhang, Int. J. Plast. 27, 201–216 (2011)10.1016/j.ijplas.2010.04.004 ↗
62. S.C. Das, A. Majumdar, S. Katiyal, B. Poojitha, S. Saha, T. Shripathi, Solid State Commun 264, 10–15 (2017)10.1016/j.ssc.2017.07.013 ↗
63. B. K. Kim , K. S. Kim , C. E. Park, C. M. Ryu J. Adhesion Sci. Technol., 16, 5, 509–521 (2002).10.1163/156856102760070349 ↗
64. S. Ercegović Ražić, R. Čunko, V. Svetličić, S. Šegota, Mater Technol. 26, 3 (2011)10.1179/175355511X13007211259006 ↗
65. G. Polettia, F. Orsinia, A. Raffaele-Addamob, C. Riccardib, E. Selli, Appl. Surf. Sci. 219, 311–316 (2003)10.1016/S0169-4332(03)00703-7 ↗
66. Y. Kusano, Plasma Process. Polym. 4, S455–S459 (2007)10.1002/ppap.200731206 ↗
67. O. Akhavan, R. Azimirad, A.Z. Moshfegh, J. Phys. D: Appl. Phys. 41, 195305 (2008)10.1088/0022-3727/41/19/195305 ↗
68. G.C. Basak, A. Bandyopadhyay, S. Neogi, A.K. Bhowmick, Appl. Surf. Sci. 257, 2891–2904 (2011)10.1016/j.apsusc.2010.10.087 ↗
69. Z. Li, P. Beck, D.A.A. Ohlberg, D.R. Stewart, R.S. Williams, Surf. Sci. 529, 410–418 (2003)10.1016/S0039-6028(03)00015-3 ↗
70. K. Panwar, M. Jassal, A.K. Agrawal, Particuology 33, 50–54 (2017)10.1016/j.partic.2016.12.004 ↗