journal article·2009-06

Fabrication of pellicle beam splitters for optical bus application

J. S. Yeo, S. Mathai, M. Tan, L. King

Applied Physics A· Volume 95· Issue 4
Publisher page

Abstract

The optical bus architecture for on-board applications requires a number of optical splitters with precise split ratios to route part of the input signal. Since hollow metal waveguide provides well collimated beams with very small gap loss, it opens the possibility of inserting discrete optical beam splitters (taps). The optical tap requires low excess loss, polarization insensitivity, temperature stability, minimized walk-off of the propagating beam, and cost effective manufacturing. By benefiting from the mature interference coating technology for polarization insensitivity and temperature stability, we design a pellicle beam splitter based on a static microelec tro-mechanical system (MEMS) and develop processes to fabricate pellicle splitters using wafer level bonding of silicon and glass substrates, with subsequent thinning to 20 µm. With the approaches described in this paper, we have demonstrated optical beam splitters with excess loss of less than 0.17 dB that operate at a data rate of 10 Gb/s showing a clean eye diagram while providing controlled split ratio and polarization insensitivity. We have demonstrated a high yielding MEMS based silicon processing platform which has the potential to provide a cost effective manufacturing solution for optical beam splitters.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Semiconductor Lasers and Optical Devices · Photonic and Optical Devices · Advanced Optical Network Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (11)

Show source-provided references
1. M. Tan, P. Rosenberg, J.S. Yeo, M. McLaren, S. Mathai, T. Morris, J. Straznicky, N.P. Jouppi, H.-P. Kuo, S.Y. Wang, S. Lerner, P. Kornilovich, N. Meyer, R. Bicknell, C. Otis, L. Seals, A high-speed optical multi-drop bus for computer interconnections, in IEEE Hot Interconnects, Stanford, CA (2008)10.1109/HOTI.2008.15 ↗
2. J.S. Yeo, R.N. Bicknell, P.E. Kornilovich, C. Otis, N. Meyer, L. Seals, S. Lerner, L. King, Development of waveguides and splitters for photonic interconnect, in HP Labs Photonic Interconnect Forum, Palo Alto, CA (2008)
3. A.J. Marcatili, R.A. Schmeltzer, Hollow metallic and dielectric waveguides for long distance optical transmission and lasers. Bell Syst. Tech. J. 43, 1783 (1993)10.1002/j.1538-7305.1964.tb04108.x ↗
4. M. Mohebbi, R. Fedosejevs, V. Gopal, J.A. Harrington, Appl. Opt. 41, 7031 (2002)10.1364/AO.41.007031 ↗
5. R. Bicknell, L. King, C.E. Otis, J.S. Yeo, N. Meyer, P. Kornilovich, S. Lerner, L. Seals, Fabrication and characterization of hollow metal waveguides for optical interconnect applications. Appl. Phys. A (2009, submitted)10.1007/s00339-009-5206-2 ↗
6. V.R. Costich, Appl. Opt. 9, 866 (1970)10.1364/AO.9.000866 ↗
7. J.S. Yeo, J. Laser, Micro/Nano Eng. 2, 69 (2007)
8. TFCalc: Software Spectra Inc.
9. B.E. Roberds, Science and technology of plasma activated direct wafer bonding. Ph.D. Dissertation, University of California at Davis, School of Engineering (1998)
10. D. Gwo, Ultra precision and reliable bonding method. US Patent 6,284,085 (2001)
11. Norland Products Inc. http://www.norlandprod.com/