Whisker Formation Concepts—The End Game
Source abstract
Abstract
This paper elaborates on previously published theories dealing with tin whisker formation mechanisms and introduces some new concepts to build a theory that is both fundamentally sound and consistent with experimental observations made to date. Central to the proposed hypothesis is the unique chevron (or V-shaped) whisker grain that forms within the as-deposited tin film grain structure. This treatment also deals with some ancillary tin film observations such as the intermetallic “pedestal” structures formed by temperature cycling and the “subsidence” structures often associated with tin whisker formation.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (55)
Show source-provided references
1. The effects of plating parameters on the microstructure and whisker growth propensity of pure Sn finish
2. 10.1109/TEPM.2007.89176310.1109/TEPM.2007.891763 ↗
3. timoshenko · Theory of Elasticity · 1970
4. boresi · Advanced Mechanics of materials · 1993
5. Local, submicron, strain gradients as the cause of Sn whisker growth10.1063/1.3147864 ↗
6. Tracer diffusion in whisker-prone tin platings
7. 10.1016/j.msea.2003.12.04210.1016/j.msea.2003.12.042 ↗
8. 10.1103/PhysRev.87.48210.1103/PhysRev.87.482 ↗
9. 10.1063/1.33406510.1063/1.334065 ↗
10. young · Formulas for Stress and Strain · 1989
11. 10.1016/0001-6160(76)90021-310.1016/0001-6160(76)90021-3 ↗
12. 10.1016/0001-6160(73)90190-910.1016/0001-6160(73)90190-9 ↗
13. A proposed mechanism for metallic whisker growth
14. 10.1103/PhysRev.91.755.210.1103/PhysRev.91.755.2 ↗
15. On tin whiskers10.1080/14786440808520351 ↗
16. 10.1109/TEPM.2005.84743810.1109/TEPM.2005.847438 ↗
17. vianco · Lead-Free Solder Interconnect Reliability · 2005 · 67
18. 10.1109/TEPM.2006.89063710.1109/TEPM.2006.890637 ↗
19. 10.1016/0001-6160(54)90053-X10.1016/0001-6160(54)90053-X ↗
20. 10.4314/jast.v2i1-2.4709510.4314/jast.v2i1-2.47095 ↗
21. 10.1016/0001-6160(55)90094-810.1016/0001-6160(55)90094-8 ↗
22. 10.1109/TEPM.2005.84744010.1109/TEPM.2005.847440 ↗
23. williams · 2010
24. Whisker formation in Sn and Pb-Sn coatings: Role of intermetallic growth, stress evolution, and plastic deformation processes10.1063/1.2912528 ↗
25. su · 2007
26. dimitrovska · 2009
27. choi · Handbook of Lead-Free Solder Technology for Microelectronic Assemblies · 2004 · 909
28. 10.1103/PhysRevLett.93.20610410.1103/PhysRevLett.93.206104 ↗
29. 10.1063/1.166305410.1063/1.1663054 ↗
30. Understanding whisker phenomenon-part II: Competitive mechanisms
31. 10.1109/TEPM.2006.88739310.1109/TEPM.2006.887393 ↗
32. Focused ion beam in microelectronics packaging applications-leadfree plating analysis
33. 10.1109/TEPM.2005.84646110.1109/TEPM.2005.846461 ↗
34. 10.1109/TEPM.2005.84744310.1109/TEPM.2005.847443 ↗
35. Tin whisker microstructural analysis
36. 10.1109/TEPM.2005.84744310.1109/TEPM.2005.847443 ↗
37. 10.1109/ECTC.2005.144129910.1109/ECTC.2005.1441299 ↗
38. 10.1109/TEPM.2006.89064510.1109/TEPM.2006.890645 ↗
39. 10.1016/j.actamat.2005.07.01610.1016/j.actamat.2005.07.016 ↗
40. 10.1016/0001-6160(58)90120-210.1016/0001-6160(58)90120-2 ↗
41. 10.1080/1478643570824382510.1080/14786435708243825 ↗
42. 10.1557/JMR.2003.007610.1557/JMR.2003.0076 ↗
43. ellis · Growth of Metal Whiskers from the Solid Growth and Perfection of Crystals · 1958 · 102
44. 10.1007/s11664-005-0274-310.1007/s11664-005-0274-3 ↗
45. 10.1103/PhysRevB.49.203010.1103/PhysRevB.49.2030 ↗
46. 10.1557/jmr.2008.035110.1557/jmr.2008.0351 ↗
47. osenbach · 2010
48. Correlation between whisker initiation and compressive stress in electrodeposited SnCu coatings on Cu lead-frames
49. 10.1109/TEPM.2007.90652010.1109/TEPM.2007.906520 ↗
50. Flexure beam
51. Driving force for Sn whisker growths in the system Cu-Sn10.1063/1.2953973 ↗
52. Effects of diffusion from brass substrates into electrodeposited tin coatings on corrosion resistance and whisker growth
53. 10.1142/S021812740401059X10.1142/S021812740401059X ↗
54. 10.1109/TEPM.2005.84744110.1109/TEPM.2005.847441 ↗
55. 10.1063/1.171012710.1063/1.1710127 ↗