journal article·2022-09Open access

D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering

Yang Yu, Yi Wang, Talal Skaik, Thomas Starke, Xiaobang Shang, Michael J. Lancaster, Peter Hunyor, Peter G. Huggard, Hui Wang, Michael Harris, Mat Beardsley, Qingsha S. Cheng

Abstract

We report a $D$ -band waveguide diplexer, with two passbands of 130–134 and 151.5–155.5 GHz, fabricated using micro laser sintering (MLS) additive manufacturing with stainless steel. This is the first demonstration of metal 3-D printing technology for multiport filtering devices at a sub-terahertz (THz) frequency. For comparison, the same diplexer design has also been implemented using computer numerical controlled (CNC) milling. The diplexer, designed using coupling matrix theory, employs an all-resonator and $E$ -plane split-block structure. The two channels are folded for compactness. A staircase coupled structure is used in one channel to increase the isolation performance. The printed waveguide flanges are modified to adapt to the limited printing volume from the MLS. Effects of fabrication tolerance on the diplexer are investigated. An effective and unconventional electroless plating process is developed. The measured average insertion losses of the gold-coated diplexer are 1.31 and 1.37 dB, respectively. The respective frequency shifts from design values are 0.92% and 1.1%, and bandwidth variations are 4% and 15%. From a comprehensive treatment of the end-to-end manufacturing process, the work demonstrates MLS to be a promising fabrication technique for complex waveguide devices at a sub-THz frequency range.
Source: openalex_inverted_index · Quality: baseline

Research context

OpenAlex topics: Microwave Engineering and Waveguides · Photonic and Optical Devices · Radio Frequency Integrated Circuit Design

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Key Laboratory of Microwave Remote Sensing, National Space Science Center, Chinese Academy of Sciences, Beijing, China

School of Electrical, Electronic and Systems Engineering, University of Birmingham, Birmingham, U.K

3D MicroPrint GmbH, Chemnitz, Germany

National Physical Laboratory, Teddington, U.K.

STFC Rutherford Appleton Laboratory, Didcot, U.K.

Department of Electrical and Electronic Engineering, Southern University of Science and Technology, Shenzhen, China

Funding

U.K. Engineering and Physical Science Research Council · National Natural Science Foundation of China · University Key Research Project of Guangdong Province

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