Efficient Transient Thermal Simulation of ICs and Packages With Laguerre-Based Finite-Element Method

In this article, an efficient approach based on Laguerre-based finite-element method (LBFEM) is proposed for transient thermal simulation of integrated circuits (ICs) and packages. The unconditionally stable marching-on-in-order scheme is developed by the weighted Laguerre polynomials and Galerkin testing procedure. In order to handle complicated ICs and packages, the finite-element method (FEM) is employed for spatial discretization and to obtain the Laguerre coefficients. The treatment of different kinds of boundary conditions is also discussed in detail. The accuracy and efficiency of the proposed method are demonstrated by numerical examples.