Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface
Source abstract
Abstract
Bonding of the heterogeneous layers of polymers as a trilayered (or multilayered) transparent metamaterial absorber (MA) is challenging, since the hydrophobic nature of interfacial surfaces does not allow direct bonding. Apart from the mechanical challenges to bond, microwave and optical functionalities of the chosen material need to be studied quantitatively for an optimal choice. Therefore, simulations are performed to study the effect of dielectric constant and thickness of adhesive on the microwave characteristics of polyethylene terephthalate (PET)–polydimethylsiloxane (PDMS)-based microwave MA (MMA). Composites of polyvinyl butyral (PVB) and 3-aminopropyltriethoxy silane (APTES) that address the need for strongly adhesive yet transparent in optical regime and non-interacting in the microwave regime have been developed. Lap-shear tests with plasma-treated PET–PDMS adherends demonstrated to have lap-shear adhesion strengths greater than 0.21 MPa. The optical transmittance of electromagnetic (EM) waves through MA after being adhered with glue is 74.9%. A numerical analysis shows that the proposed microwave absorber absorbs more than 90% of EM waves within the range of 7.97–20.72 GHz after an additional layer of optimal adhesive, which is validated through experiments conducted in anechoic measurements.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Antenna and Metasurface Technologies · Metamaterials and Metasurfaces Applications · Electromagnetic wave absorption materials
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Material Science Program, Indian Institute of Technology Kanpur, Kanpur, India
Department of Mechanical Engineering, Indian Institute of Technology Kanpur, Kanpur, India
Department of Electrical Engineering, Indian Institute of Technology Kanpur, Kanpur, India
Material Science Program and the Department of Mechanical Engineering, Indian Institute of Technology Kanpur, Kanpur, India
Department of Physics, Indian Institute of Technology Kanpur, Kanpur, India
Funding
Science and Engineering Research Board, India
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