Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies
Source abstract
Abstract
Future multichip packages require Die-to-Die (D2D) interconnects operating at frequencies above 10 GHz; however, the extension of copper interconnects and epoxy dielectrics presents a trade-off between performance and reliability. This paper explores insertion losses and adhesion as a function of interface roughness at frequencies up to 18 GHz. We probe epoxy surface chemistry as a function of curing time and use wet etching to modulate surface roughness. The morphology is quantified by atomic force microscopy (AFM) and two-dimensional fast Fourier transform (2D FFT). Peel test and vector network analysis are used to examine the impacts of both type and level of roughness. The trade-offs between power efficiency and reliability are presented and discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Gordon A. and Mary Cain Department of Chemical Engineering, Louisiana State University, Baton Rouge, LA, USA
Texas Instruments Incorporated, Dallas, TX, USA
NXP Semiconductors, Austin, TX, USA
Department of Mechanical and Industrial Engineering and the Center for Bio-Modular Multiscale Systems, Louisiana State University, Baton Rouge, LA, USA
Funding
Semiconductor Research Corporation · National Institutes of Health
References (57)
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