Integrating and Interfacing Flexible Electronics in Hybrid Large-Area Systems
Source abstract
Abstract
An approach to creating large-area systems is described that combines flexible thin-film electronic sensor surfaces with complementary metal-oxide-semi-conductor (CMOS) integrated circuits (ICs). Complete systems are built by lamination of multiple layers, consisting of thin-film subsystems and CMOS ICs on a passive flexible substrate. A flexible passive backplane provides in-plane interconnections. Via-type interconnections between stacked layers are made by inductive or capacitive coupling. Steps and testing techniques, from devices and circuits to fully integrated hybrid systems, are illustrated.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Advanced Sensor and Energy Harvesting Materials · Gas Sensing Nanomaterials and Sensors · Tactile and Sensory Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
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