journal article·2025-06

Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators

Venkatesh Avula, Prahalad Murali, Madhavan Swaminathan

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Abstract

Novel package-embedded inductors utilizing a dual-core spiral topology, designed for improved performance in integrated power delivery systems, are presented in this paper. The proposed inductor features a simple fabrication process, gapped magnetic cores for stable performance across varying operating conditions, and overlapping spiral windings in adjacent layers, achieving high inductance density. The proposed topology consists of a spiral-shaped conductor winding layer sandwiched between two magnetic core layers. The conductor and insulating dielectric layers separate the cores and act as an air gap for the magnetic flux of the spiral inductor. The air gap causes an increase in the saturation current performance of the inductor. In addition to the single spiral winding, two advanced spiral inductor configurations, namely two spiral windings in series and parallel, are explored. To enable design, a physical model and analytical monomial expressions are provided for inductance calculation. To evaluate the performance of these designs, three inductor samples are fabricated with two different magnetic core materials and air gaps. Overall, package-embedded dual-core spiral inductors with a performance of 115nH inductance with 5 A saturation current and 330nH inductance with 3.5 A saturation current, occupying a 9 mm2 area and having efficiencies ranging from 75% to 80%, are demonstrated.
Source: openalex_inverted_index · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Advanced DC-DC Converters · Electromagnetic Compatibility and Noise Suppression · Real-time simulation and control systems

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Electrical and Computer Engineering and the 3-D Systems Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, USA

School of Electrical Engineering and Computer Science, Penn State University, University Park, PA, USA

Funding

Applications and Systems-Driven Center for Energy-Efficient Integrated NanoTechnologies (ASCENT) and Center for Heterogeneous Integration of Micro Electronic Systems · Two of Six Centers in Joint University Microelectronics Program · Semiconductor Research Corporation Program through Defense Advanced Research Projects Agency

References (22)

Show source-provided references
1. 10.1109/apec.2014.680334410.1109/apec.2014.6803344 ↗
2. 10.1109/TCPMT.2021.306569010.1109/TCPMT.2021.3065690 ↗
3. Bakir · 2009
4. 10.1109/EDAPS50281.2020.931289410.1109/EDAPS50281.2020.9312894 ↗
5. 10.1109/TCPMT.2021.312424810.1109/TCPMT.2021.3124248 ↗
6. 10.1109/ECTC.2013.657573110.1109/ECTC.2013.6575731 ↗
7. 10.1109/ECTC51906.2022.0005610.1109/ECTC51906.2022.00056 ↗
8. 10.1109/ECTC32696.2021.0020810.1109/ECTC32696.2021.00208 ↗
9. 10.1109/TPEL.2012.219889110.1109/TPEL.2012.2198891 ↗
10. Design and demonstration of embedded inductors for high-voltage integrated voltage regulators
11. 10.1109/TCPMT.2021.311694610.1109/TCPMT.2021.3116946 ↗
12. Quilici
13. 10.1109/TPEL.2013.228326310.1109/TPEL.2013.2283263 ↗
14. 10.1109/TCPMT.2021.310500310.1109/TCPMT.2021.3105003 ↗
15. Fabrication of package embedded spiral inductors with two magnetic layers for flexible SIP point of load converters in Internet of Everything devices10.1016/j.mee.2017.12.012 ↗
16. 10.1109/APEC.2019.872220910.1109/APEC.2019.8722209 ↗
17. 10.1109/4.79262010.1109/4.792620 ↗
18. 10.1002/9781118717806.ch1010.1002/9781118717806.ch10 ↗
19. 10.1109/TPEL.2012.222781510.1109/TPEL.2012.2227815 ↗
20. Semi-additive patterning process based fabrication of miniaturized, package-embedded high conversion ratio inductors for DC–DC converters
21. 10.1109/ECTC.2014.689733510.1109/ECTC.2014.6897335 ↗
22. 10.1109/ectc32862.2020.0007110.1109/ectc32862.2020.00071 ↗