DataVXIEEE Transactions on Components, Packaging and Manufacturing TechnologyPaper
journal article·2024-08

Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology

Xin Zhou, Gang Zhang, Kam-Weng Tam, Shichang Chen, Zhuowei Zhang, Xiaodong Fu

IEEE Transactions on Components, Packaging and Manufacturing Technology· Volume 14· Issue 8
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Source abstract

Abstract

In this work, a new 45-GHz millimeter-wave (mm-wave) on-chip bandpass filter (BPF) for IEEE 802.11aj standard application is presented. The BPF is designed using a hybrid structure of shield half-mode substrate integrated waveguide (SHMSIW) and microstrip in 0.25 μm gallium arsenide (GaAs) pHEMT technology. Firstly, a second-order SHMSIW on-chip BPF is developed. The metal layer forms electric walls when connected to discrete vias, whereas it forms magnetic walls when they are not connected. Ulteriorly, to enhance frequency selectivity, two coupled microstrip resonators are embed into the coupling window of the two coupled SHMSIW cavities. The cross couplings between these hybrid resonators introduce two transmission zeros (TZs), achieving high frequency selectivity without increasing the original circuit size. For verification, a quasi-elliptic on-chip BPF prototype is designed, fabricated, and measured. The measured results show good consistency with the simulated ones.
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Research context

OpenAlex topics: Microwave Engineering and Waveguides · Millimeter-Wave Propagation and Modeling · Radio Frequency Integrated Circuit Design

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

Department of Electrical and Computer Engineering, Faculty of Science and Technology, University of Macau, Macao, SAR China

Jiangsu Key Laboratory of 3-D Printing Equipment and Manufacturing and School of Electrical and Automation Engineering, Nanjing Normal University, Nanjing, China

Key Laboratory of RF Circuit and System, Ministry of Education, College of Electronics and Information, Hangzhou Dianzi University, Hangzhou, China

Zhongtian Communication Technology Company Ltd., Nantong, China

Funding

National Natural Science Foundation of China · Qing Lan Project of Jiangsu Province of China, the University of Macau · Science and Technology Development Fund · Guangdong Provincial Department of Science and Technology

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