Impact of Packaging Design on Reliability of Large Die Cu/Low-$\kappa$ (BD) Interconnect
Source abstract
Abstract
This paper presents the study on the effect of low-κ stacked layer, chip pad design structures, and shift pad design of a large die size Cu/low-κ chip for improving assembly and reliability performance on organic buildup substrate flip chip ball grid array (FCBGA). Bump shear characterization has been performed on the integrity of different stacked layer and pad structure, supported by bump shear modeling analysis. Initial reliability testing was performed on assembled package to identify the best choice of design and finally implemented on the reliability test vehicle for verification. In addition, a potential chip crack problem due to excessive warpage in FCBGA with large die assembly is examined and a simple failure criterion is proposed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Integrated Circuits and Semiconductor Failure Analysis
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (10)
Show source-provided references
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