journal article·2024-11

Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm

Haoxiang Huang, Fengjuan Wang, Xiangkun Yin, Minghua Zhao, Ming Xu, Ningmei Yu, Yuan Yang, Cheng Shi

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Abstract

In this work, an effective and efficient optimization strategy for 3-D inductors based on through-silicon via (TSV) is proposed. This strategy is based on the nondominated sorting genetic algorithm-II (NSGA-II) and introduces the artificial neural network (ANN) and vector fitting (VF) for surrogate modeling. It reduces time-consuming multitimes electromagnetic (EM) simulations while obtaining Pareto sets. The effectiveness of this optimization strategy can be demonstrated by the presentation of the cases. The accuracy of the strategy is corroborated by comparing the data of solution sets with the EM simulation results. Meanwhile, the time consumed by the optimization process in this strategy is only about 30 min after ANN training.
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Research context

OpenAlex topics: 3D IC and TSV technologies · Electromagnetic Compatibility and Noise Suppression · Electronic Packaging and Soldering Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Automation and Information Engineering, Xi’an University of Technology, Xi’an, China

Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi’an, China

School of Computer Science and Engineering, Xi’an University of Technology, Xi’an, China

Department of Applied Physics, Xi’an University of Technology, Xi’an, China

Funding

National Natural Science Foundation of China · National Key Research and Development Program of China · Key Research and Development Projects of Shaanxi Province · Shaanxi Provincial Science and Technology Activities for Oversea Scholars · Seed Fund for Creativity and Innovation of Postgraduates of Xi’an University of Technology

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