Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm
Abstract
Research context
OpenAlex topics: 3D IC and TSV technologies · Electromagnetic Compatibility and Noise Suppression · Electronic Packaging and Soldering Technologies
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Affiliations
School of Automation and Information Engineering, Xi’an University of Technology, Xi’an, China
Key Laboratory of Analog Integrated Circuits and Systems (Ministry of Education), School of Integrated Circuits, Xidian University, Xi’an, China
School of Computer Science and Engineering, Xi’an University of Technology, Xi’an, China
Department of Applied Physics, Xi’an University of Technology, Xi’an, China
Funding
National Natural Science Foundation of China · National Key Research and Development Program of China · Key Research and Development Projects of Shaanxi Province · Shaanxi Provincial Science and Technology Activities for Oversea Scholars · Seed Fund for Creativity and Innovation of Postgraduates of Xi’an University of Technology