Differential Via Modeling Methodology
Source abstract
Abstract
This paper describes a novel method of modeling the differential via on multilayered printed circuit boards (PCBs) used in high-speed digital designs based on the analytical equations for characteristic impedance and effective dielectric constant. In the absence of measured or electromagnetic simulated data traditionally needed to extract these parameters, this method can quickly and efficiently predict the behavior of the differential via holes on PCBs using a circuit simulator.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electromagnetic Compatibility and Noise Suppression · Electromagnetic Simulation and Numerical Methods · Microwave Engineering and Waveguides
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References (10)
Show source-provided references
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