Optimization Design of Fixed-Length Bond-Wire Interconnection in Multichips Module
Source abstract
Abstract
This paper studies signal integrity problems caused by parasitic parameters and skin effect of bond wire. Based on the low-pass filter theory, this paper proposes a new design of bond-wire interconnection circuit in microwave multichip modules. The transmission characteristics of bond-wire interconnection circuit can be significantly improved when the length of bond wire is fixed. A compensation structure based on the third-order Butterworth low-pass filter is presented. In comparison with the uncompensated structure, the bandwidth of the bond wire is increased by 25.1 GHz with the proposed design. Moreover, a compensation structure based on the fifth-order Chebyshev low-pass filter is presented, too. In comparison with the uncompensated structure, the parasitic effects of the bond wire are minimized, and the bandwidth is increased by 56.8 GHz with the proposed design. The microwave circuit design software and electromagnetic field software were used to model and analyze the microwave characteristics of this circuit. The circuit was verified by the results of the simulation.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Semiconductor Lasers and Optical Devices · Electromagnetic Compatibility and Noise Suppression · 3D IC and TSV technologies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (22)
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