Foreword Special Section on Through Silicon Vias
Source abstract
Abstract
The 11 papers in this special section present a snapshot of recent progress in electrical modeling and design of through silicon vias (TSVs) by researchers from both academia and industry. The section is organized into three main areas. The first group of papers deals with the electromagnetic modeling of TSVs. The second group of papers is on the signal integrity and power integrity analysis of TSV interconnections. The third group of papers explores the system architectures and applications that might benefit from the TSV technology.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: 3D IC and TSV technologies · Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
Reference metadata was not supplied for this record.