journal article·2012-01

Aluminum-Based Mechanical and Electrical Laser Interconnection Process for Module Integration of Silicon Solar Cells

Henning Schulte-Huxel, Robert Bock, Susanne Blankemeyer, Agnes Merkle, Rolf Brendel

IEEE Journal of Photovoltaics· Volume 2· Issue 1
Publisher page

Abstract

In this paper, an interconnection method for the module integration of silicon solar cells by laser microwelding of the Al-metalized rear side of the solar cell to a metalized substrate is introduced. This laser microwelding process forms a direct mechanical and electrical connection between two Al-layers without the need for any soldering, conductive adhesives, or Ag-pastes. With a tensile tester, we measure tear-off stresses of up to 303 kPa for our laser weld spots. Furthermore, carrier lifetime measurements show that no defects are induced into the Si-crystal by the laser process over a wide range of laser pulse energies and number of laser pulses. In order to demonstrate the applicability of this laser-based interconnection method, we present a proof-of-concept module consisting of five n-type back-junction back-contact solar cells with a conversion efficiency of 20.0%.
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Research context

OpenAlex topics: Silicon and Solar Cell Technologies · Integrated Circuits and Semiconductor Failure Analysis · Thin-Film Transistor Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

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