Modelling of wafer heating during rapid thermal processing
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OpenAlex topics: Silicon and Solar Cell Technologies · 3D IC and TSV technologies · Thin-Film Transistor Technologies
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References (13)
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9. T.-J. Shieh, R.L. Carter: IEEE Trans. ED-36, 19 (1989)10.1109/16.21172 ↗
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11. T.E. Seidel, S.J. Lischner, C.S. Pai, S.S. Lau: J. Appl. Phys. 57, 1317 (1985)10.1063/1.334532 ↗
12. S. Kakac, Y. Yener: Heat Conduction, 2nd edn. (Hemisphere, Washington 1985)
13. R. Kakoschke, E. Bußmann, H. Föll: To be published