journal article·2014-09

Electrical properties and conduction mechanism of an organic-modified Au/NiPc/n-InP Schottky barrier diode

V. Rajagopal Reddy

Applied Physics A· Volume 116· Issue 3
Publisher page

Abstract

The effect of nickel phthalocyanine (NiPc) organic interlayer on the electronic parameters of Au/n-InP Schottky contacts has been investigated using current–voltage (I–V) and capacitance–voltage (C–V) measurements. Measurements showed that the barrier heights and ideality factors are 0.58 eV (I–V), 0.69 eV(C–V) and 1.32 for Au/n-InP Schottky contact and 0.80 eV (I–V), 1.12 eV (C–V) and 1.73 for Au/NiPc/n-InP Schottky contact, respectively. Experimental results show that the interfacial layer of NiPc increases the effective barrier height by the influence of the space charge region of the Au/n-InP Schottky junction. Further, Cheung’s and modified Norde functions are used to extract the barrier height, series resistance and ideality factors. The discrepancy between barrier heights estimated from I–V to C–V methods is also explained. Moreover, the energy distribution of interface state density is determined from the forward bias I–V data. Results show that the interface states and series resistance play an important role on electrical properties of the structures studied. The reverse leakage current conduction mechanism is investigated. Results reveal that the Schottky conduction mechanism is found to be dominant in the Au/n-InP Schottky contact. However, in the case of Au/NiPc/n-InP Schottky contact, the Schottky conduction mechanism is found to be dominant in the higher bias region, while Poole–Frenkel conduction is found to be dominant in the lower bias region.
Source: openaire · Quality: candidate unverified · Source record ↗

Research context

OpenAlex topics: Semiconductor materials and interfaces · Integrated Circuits and Semiconductor Failure Analysis · Nanowire Synthesis and Applications

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (45)

Show source-provided references
1. M.E. Aydin, A. Turut, Microelectron. Eng. 84(12), 2875 (2007)10.1016/j.mee.2007.02.010 ↗
2. M. Zhu, T.H. Cui, K. Varahramyan, Microelectron. Eng. 75(3), 269 (2004)10.1016/j.mee.2004.05.011 ↗
3. G. Lloyd, M. Raja, I. Sellers, N. Sedghi, R. Di Lucrezia, S. Higgins, B. Eccleston, Microelectron. Eng. 59, 323 (2001)10.1016/S0167-9317(01)00617-7 ↗
4. S.A. Moiz, M.M. Ahmed, K.S. Karimov, ETRI J. 27(3), 319 (2005)10.4218/etrij.05.0104.0100 ↗
5. W.C. Huang, T.F. Lie, C.L. Lee, J. Appl. Phys. 78(1), 291 (1995)10.1063/1.360673 ↗
6. O. Gullu, O. Baris, M. Biber, A. Turut, Appl. Surf. Sci. 254, 3039 (2008)10.1016/j.apsusc.2007.10.082 ↗
7. M.D. Aydin, F.J. Yakuphanoglu, Phys. Chem. Solids 68, 1770 (2007)10.1016/j.jpcs.2007.04.023 ↗
8. M.M. El-Nahass, K.F. Abd-El-Rahman, A.A.M. Farag, A.A.A. Darwish, Org. Electron. 6, 129 (2005)10.1016/j.orgel.2005.03.007 ↗
9. A.R. Vearey-Roberts, D.A. Evans, Appl. Phys. Lett. 86, 072105 (2005)10.1063/1.1864255 ↗
10. O. Gullu, Microelectron. Eng. 87, 648 (2010)10.1016/j.mee.2009.09.001 ↗
11. J. Jortner, M.A. Ratner, Molecular electronics (American Chemical Society, Washington, DC, 1997)
12. F.E. Jones, B.P. Wood, J.A. Myers, C.D. Hafar, M.C. Lorengan, J. Appl. Phys. 86, 6431 (1999)10.1063/1.371707 ↗
13. M. Soylu, B. Abay, Y. Onganer, J. Phys. Chem. Solids 71, 1398 (2010)10.1016/j.jpcs.2010.07.003 ↗
14. O. Gullu, A. Turut, J. Vac. Sci. Technol. B 28(3), 466 (2010)10.1116/1.3377141 ↗
15. A.A.M. Farag, I.S. Yahia, Synth. Met. 161, 32 (2011)10.1016/j.synthmet.2010.10.030 ↗
16. O. Gullu, S. Aydogan, A. Turut, Thin Solid Films 520, 1944 (2012)10.1016/j.tsf.2011.09.043 ↗
17. M. Enver Aydin, F. Yakuphanoglu, Microelectron. Relia 52, 1350 (2012)10.1016/j.microrel.2012.03.005 ↗
18. V. Rajagopal Reddy, M. Siva Pratap Reddy, A. Ashok Kumar, C.J. Choi, Thin Solid Films 520, 5715 (2012)10.1016/j.tsf.2012.04.020 ↗
19. O. Gullu, S. Aydogan, A. Turut, Solid State Commun. 152, 381 (2012)10.1016/j.ssc.2011.12.007 ↗
20. F. Petraki, V. Papaefthimiou, S. Kennou, Org. Electron. 8, 522 (2007)10.1016/j.orgel.2007.03.006 ↗
21. P.D. Hooper, M.I. Newton, G. McHale, M.R. Willis, Semicond. Sci. Technol. 12, 455 (1997)10.1088/0268-1242/12/4/020 ↗
22. K.N. Narayanan Unni, C.S. Menon, Mater. Lett. 45, 326 (2000)10.1016/S0167-577X(00)00127-0 ↗
23. E.H. Rhoderick, R.H. Williams, Metal-semiconductor contacts, 2nd edn. (Clarendon, Oxford, 1988)
24. C.W. Wilmsen, Physics and chemistry of III-V compound semiconductor interfaces (Plenum Press, New York, 1985)10.1007/978-1-4684-4835-1 ↗
25. D.T. Quam, H. Hbib, Solid State Electron. 36, 339 (1993)10.1016/0038-1101(93)90085-5 ↗
26. W. Monch, J. Vac. Sci. Technol. B 17, 1867 (1999)10.1116/1.590839 ↗
27. R.T. Tung, Phys. Rev. B 45, 13509 (1992)10.1103/PhysRevB.45.13509 ↗
28. D.R.T. Zahn, T.U. Kampen, H. Mendez, Appl. Surf. Sci. 212, 423 (2003)10.1016/S0169-4332(03)00125-9 ↗
29. A. Ashok Kumar, V. Rajagopal Reddy, V. Janardhanam, M.W. Seo, H.B. Hong, K.S. Shin, C.-J. Choi, J. Electrochem. Soc. 159, H33 (2012)10.1149/2.041201jes ↗
30. A. Bengi, U. Aydemir, S. Altındal, Y. Ozen, S.J. Ozcelik, J. Alloys Compd. 505, 628 (2010)10.1016/j.jallcom.2010.06.095 ↗
31. H. Altuntas, S. Altındal, S. Ozcelik, H. Shtrikman, Vacuum 83, 1060 (2009)10.1016/j.vacuum.2009.01.002 ↗
32. S. Aydogan, M. Saglam, A. Turut, Microelectron. Eng. 85, 278 (2008)10.1016/j.mee.2007.06.004 ↗
33. S.K. Cheung, W.N. Cheung, Appl. Phys. Lett. 49, 85 (1986)10.1063/1.97359 ↗
34. T. Kilicoglu, Thin Solid Films 516, 967 (2008)10.1016/j.tsf.2007.06.022 ↗
35. H. Norde, J. Appl. Phys. 50, 5052 (1979)10.1063/1.325607 ↗
36. H.C. Card, E.H. Rhoderick, J. Phys. D Appl. Phys. 4, 1589 (1971)10.1088/0022-3727/4/10/319 ↗
37. X.J. Wang, L. He, Electron. Mater. 27, 1272 (1998)10.1007/s11664-998-0082-7 ↗
38. J.H. Werner, H.H. Guttler, J. Appl. Phys. 69, 1522 (1991)10.1063/1.347243 ↗
39. Y.P. Song, R.L. Van Meirhaeghe, W.H. Laflere, F. Cardon, Solid State Electron. 29, 633 (1986)10.1016/0038-1101(86)90145-0 ↗
40. A. Turut, B. Bati, A. Kokce, M. Saglam, N. Yalcin, Phys. Scr. 53, 118 (1996)10.1088/0031-8949/53/1/023 ↗
41. V. Janardhanam, Y.K. Park, K.S. Ahn, C.J. Choi, J. Alloys Compd. 534, 37 (2012)10.1016/j.jallcom.2012.04.031 ↗
42. A. Ashok Kumar, V. Rajagopal Reddy, V. Janardhanam, H.D. Yang, H.J. Yun, C.J. Choi, J. Alloys Compd. 549, 18 (2013)10.1016/j.jallcom.2012.09.085 ↗
43. A.S. Raid, Phys. B 270, 148 (1999)10.1016/S0921-4526(99)00128-3 ↗
44. A.C. Varghes, C.S. Menon, Eur. Phys. J. B 47, 485 (2005)10.1140/epjb/e2005-00352-7 ↗
45. D.N. Khan, M.H. Sayyad, Second international conference on computer research and development. (IEEE Conference Publications, Kualalumpur, 2010), pp. 535–53910.1109/ICCRD.2010.114 ↗