Femtosecond laser micromachining of grooves in silicon with 800 nm pulses
Source abstract
Abstract
Femtosecond laser micromachining of grooves in silicon is investigated using 150 fs pulses with a center wavelength of 800 nm. Ablation rates are investigated as a function of pulse energy, translation speed, and the number of consecutive passes. The effect of the laser polarization relative to the translation direction is observed, and the morphologies of the groove walls are examined. In addition, the uniformity of the groove depth is investigated as a function of the number of passes of the sample under the beam.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Laser Material Processing Techniques · Ocular and Laser Science Research · Advanced Surface Polishing Techniques
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