Gallium-based thermal interface material with high compliance and wettability
Source abstract
Abstract
This study reports a gallium-based thermal interface material (GBTIM) consisting of gallium oxides dispersed uniformly into the 99 % gallium metal. The wettability of GBTIM with other materials is disclosed and compared. The thermal conductivity of GBTIM measured by a computer-controlled Mathis TCi thermal analyzer is ∼13.07 W m−1 K−1 at room temperature, which is significantly higher than that of conventional thermal greases. An experimental facility is described to measure the thermal resistance across the GBTIM under steady-state conditions and the thermal interface resistance is measured as low as 2.6 mm2 kW−1 with a pressure of 0.05 MPa, which is an order lower than that of the best commercialized thermal greases. Further, the GBTIM is formed into a desired shape to enhance thermal transfer, such as semi-liquid paste or thermal pad, which can be cut into a required shape.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Thermal properties of materials · Advanced Thermoelectric Materials and Devices · Thermal Expansion and Ionic Conductivity
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (26)
Show source-provided references
1. J. Donald, M. Martonosi, in Proceedings of the 33rd International Symposium on Computer Architecture (ISCA), vol. 78 (2006)
2. T. Treurniet, V. Lammens, in 22nd IEEE SEMI-THERM Symposium, vol. 173 (2006)
3. I. Mudawar, IEEE Trans. Compon. Packag. Technol. 24, 122 (2001)10.1109/6144.926375 ↗
4. S. Whalen, M. Thompson, D. Bahr, C. Richards, R. Richards, Sens. Actuators A 104, 290 (2003)10.1016/S0924-4247(03)00032-3 ↗
5. U. Ghoshal, S. Ghoshal, C. McDowell, L. Shi, S. Cordes, M. Farinelli, Appl. Phys. Lett. 80, 3006 (2002)10.1063/1.1473233 ↗
6. G. Cha, Y. Sungtaek Ju, in ASME Int. Mech. Eng. Congress. Expos. Proc., vol. 12, p. 927 (2010)
7. J. Xu, T.S. Fisher, Int. J. Heat Mass Transf. 49, 1658 (2006)10.1016/j.ijheatmasstransfer.2005.09.039 ↗
8. H.F. Chuang, S.M. Cooper, M. Meyyappan, B.A. Cruden, J. Nanosci. Nanotechnol. 4, 964 (2004)10.1166/jnn.2004.152 ↗
9. D. Chung, J. Mater. Eng. Perform. 10, 56 (2001)10.1361/105994901770345358 ↗
10. A. Yu, P. Ramesh, M.E. Itkis, E. Bekyarova, R.C. Haddon, J. Phys. Chem. C 111, 7565 (2007)10.1021/jp071761s ↗
11. Y. Wu, C.H. Liu, H. Huang, S.S. Fan, Appl. Phys. Lett. 87, 3108 (2005)
12. B.A. Cola, X. Xu, T.S. Fisher, Appl. Phys. Lett. 90, 3513 (2007)
13. B.A. Cola, J. Xu, C. Cheng, X. Xu, T.S. Fisher, H. Hu, J. Appl. Phys. 101, 4313 (2007)
14. A. Hamdan, A. McLanahan, R. Richards, C. Richards, Exp. Therm. Fluid Sci. 35, 1250 (2011)10.1016/j.expthermflusci.2011.04.012 ↗
15. J. Liu, Y.X. Zhou, China Patent No. 02131419.5 (2002)
16. K.Q. Ma, J. Liu, Phys. Lett. A 361, 252 (2007)10.1016/j.physleta.2006.09.041 ↗
17. Y.G. Deng, J. Liu, Heat Mass Transf. 46, 1327 (2010)10.1007/s00231-010-0658-7 ↗
18. P.P. Li, J. Liu, Appl. Phys. Lett. 99, 094106 (2011)
19. P.P. Li, J. Liu, J. Electron. Packag. 133, 041009 (2011)
20. R.B. Booth, G.W. Grube, P.A. Gruber, I.Y. Khandros, R. Zingher, US Patent, No 5.198.189 (1992)
21. L.T. Taylor, J. Rancourt, US Patent, NO 5.792.236 (1998)10.1016/S0958-2118(98)90297-X ↗
22. S.C. Hardy, J. Cryst. Growth 7, 602 (1985)10.1016/0022-0248(85)90367-7 ↗
23. T. Iida, R.I.L. Guthrie, The Physical Properties of Liquid Metals (Clarendon, Oxford, 1993)
24. J.P. Gwinn, R.L. Webb, Microelectron. J. 34, 215 (2003)10.1016/S0026-2692(02)00191-X ↗
25. M. Grujicic, C.L. Zhao, E.C. Dusel, Appl. Surf. Sci. 246, 290 (2005)10.1016/j.apsusc.2004.11.030 ↗
26. http://www.coollaboratory.com/en/products/