journal article·2026-06

Synergistic improvement of rheological, thermal conductive, and dielectric properties for epoxy resin composites based on active organic small molecules and inorganic fillers

Zhe Zhang, Dong Yue, Jian Wang, Qixin Yuan, Yuanhang Yao, Wenchao Zhang, Zhou Yang, Qiang Fu, Yu Feng

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Abstract

No abstract is available for this record. The assistant can identify its topic from the title, but cannot infer the study’s results.

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OpenAlex topics: Thermal properties of materials · Epoxy Resin Curing Processes · High voltage insulation and dielectric phenomena

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References (38)

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