An Empirical Model for Resin Viscosity During Cure in Vacuum Infusion Molding Process
Source abstract
Abstract
The rheological behaviors of a low viscosity epoxy resin system (RIMR135/RIMH137) for vacuum infusion molding process (VIMP) were studied with viscosity experiments. And an empirical model has been developed to predict the viscosity of the resin system during curing at low extents of cure, which is of significance during the mould filling stage in VIMP. Good agreement is observed between the experimental data and the model predicted viscosity. The processing windows of the resin system for VIMP can be predicted by the proposed models. The results show that the optimum processing temperature range of RIMR135/RIMH137 epoxy resin system for VIMP is from 25°C to 45°C, at which the resin system can maintain the viscosity less than 500 mPa·s for 75 min at least.
Source: openaire · Quality: candidate unverified · Source record ↗
Research context
OpenAlex topics: Epoxy Resin Curing Processes · Injection Molding Process and Properties · Rheology and Fluid Dynamics Studies
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References (12)
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1. Brouwer, W.D., Vanherpt, E.C., Labordus, M.: Vacuum injection moulding for large structural applications. Compos. Appl. Sci. Manuf. 34, 551–558 (2003)10.1016/S1359-835X(03)00060-5 ↗
2. Correia, N.C., Robitaille, F., Long, A.C., Rudd, C.D., Simacek, P., Advani, S.G.: Analysis of the vacuum infusion molding process: I. Analytical formulation. Compos. Appl. Sci. Manuf. 26, 1645–1656 (2005)10.1016/j.compositesa.2005.03.019 ↗
3. Cheng, K.C., Chiu, W.Y., Hsieh, K.H.: Chemorheology of epoxy resin Part I Epoxy resin cured with tertiary amine. J. Mater. Sci. 29, 721–727 (1994)10.1007/BF00445985 ↗
4. Kiuna, N., Lawrence, C.J., Fontana, Q.P.V., et al.: A model for resin viscosity during cure in the resin transfer moulding process. Compos. Appl. Sci. Manuf. 33, 1497–1503 (2002)10.1016/S1359-835X(02)00177-X ↗
5. Roller, M.B.: Characterization of the time-temperature-viscosity behavior of curing B-staged epoxy resin. Polym. Eng. Sci. 15, 406–416 (1975)10.1002/pen.760150603 ↗
6. Roller, M.B.: Rheology of curing thermosets: a review. Polym. Eng. Sci. 26, 432–440 (1986)10.1002/pen.760260610 ↗
7. Simon, S.L., Gillham, J.K.: Thermosetting cure diagrams: calculation and application. J. Appl. Polym. Sci. 53, 709–727 (1994)10.1002/app.1994.070530601 ↗
8. Mijovic, J., Lee, C.H.: A comparison of chemorheological models for thermoset cure. J. Appl. Polym. Sci. 38, 2155–2170 (1989)10.1002/app.1989.070381201 ↗
9. Perry, M.J., Wang, T.J., Ma, Y., et al. Resin transfer moulding of epoxy/graphite composites. Proc 24th Int SAMPE Tech Conf. 24, 421–435 (1992).
10. Bidstrup, S.A., Macosko, C.W.: Chemorheology relations for epoxy/amine cross-linking. J. Polym. Sci., Part B: Polym. Phys. 28, 691–709 (1990)10.1002/polb.1990.090280508 ↗
11. Shi, F., Duan, Y.X., Zeng, X.N., et al.: Engineering viscosity model for bisphenol-A epoxy resin/catalytic curing agent system. Acta Mater. Compos. Sin. 18, 16–19 (2001). in Chinese
12. Williams, M.L., Landel, R.F., Ferry, J.D.: The temperature dependence of relaxation mechanisms in amorphous polyers and other glassforming liquids. J. Am. Chem. Soc. 77, 3701–3707 (1955)10.1021/ja01619a008 ↗