journal article·2024-10-01Open access

Experimental study on spheroidal morphology of palladium coated copper wire with different palladium layer thickness

Bin An, Hongliang Zhou, Jun Cao, Pingmei Ming, Jie Xia, Jingguang Yao, John Persic, Yuemin Zhang

APL Materials· Volume 12· Issue 10

Abstract

Palladium (Pd) coated copper (PCC) wire is an emerging bonding wire that has been widely researched. In this paper, the effects of electronic flame-off (EFO) current and EFO time on the free air ball (FAB) morphology of four PCC wires with Pd layer thicknesses of 60, 80, 100, and 120 nm, respectively, are first investigated. The larger the EFO current or the longer the EFO time, the larger the FAB diameter. The EFO time or EFO current setting is either too high or too low to form a FAB with good morphology. Taking the ratio of FAB diameter to wire diameter as 2 as the standard, the EFO current of 48 mA and the EFO time of 700 μs are selected as the optimal EFO parameter combination. Under this parameter combination, the symmetry, roundness, and surface smoothness of the FAB of the four PCC wires are all at a better level. It is found that the FAB surface Pd coverage of PCC wire with 120 nm Pd layer thickness is higher through the corrosion test. The Pd transfer law on the FAB at different EFO times under optimal EFO current is also studied. The results show that with the prolongation of the EFO time, the Pd on the FAB surface is gradually transferred from the neck to the middle and lower parts. This study can provide technical reference for the selection of Pd layer thickness and EFO parameters of PCC wire.
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Research context

OpenAlex topics: Electronic Packaging and Soldering Technologies · Copper Interconnects and Reliability · Metal Forming Simulation Techniques

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

Affiliations

School of Mechanical and Power Engineering, Henan Polytechnic University 1 , Jiaozuo 454003,

Henan International Joint Laboratory of Advanced Electronic Packaging Materials Precision Forming, Henan Polytechnic University 2 , Jiaozuo 454003,

Microbonds Inc. 3 , 7495 Birchmount Rd, Markham, Ontario L3R 5G2,

Funding

National Natural Science Foundation of China · Key Science and Technology Program of Henan Province · Fundamental Research Funds for the Universities of Henan Province · Doctoral Fund of Henan Polytechnic University

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