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1. Research progress of palladium-plated copper bonding wire in microelectronic packaging
10.3390/mi14081538 ↗3. Shear force classification before wire bonding based on probe mark 2-D images using machine learning methods
10.1109/tsm.2022.3162401 ↗9. Effects of process parameters on bond properties of Ag-2.35Au-0.7Pd-0.2Pt-0.1Cu alloy wire
10.3390/mi14081587 ↗10. 2017 · V001T05A004
15. A technology for bonding Cu wires with Cu pads: Structure and electrical fatigue mechanism of fine micro-alloyed Cu wires
10.1007/s11664-023-10381-2 ↗16. Investigations on the mechanism of microweld changes during ultrasonic wire bonding by molecular dynamics simulation
10.1016/j.matdes.2020.108718 ↗17. Failure mode and mechanism analysis for Cu wire bond on Cu/low-k chip by wire pull test and finite-element analysis
10.1109/TDMR.2018.2808348 ↗21. A study of the sulfidation behavior on palladium-coated copper wire with a flash-gold layer (PCA) after wire bonding
10.3390/electronics8070792 ↗22. Mechanism of microweld formation and breakage during Cu–Cu wire bonding investigated by molecular dynamics simulation
10.1088/1674-1056/ac0e24 ↗24. Development trend of palladium-plated bonded copper wires
25. A comparative study on the bonding of palladium-plated copper wire and bare copper wire in IC packaging
26. Effect of palladium-plated copper wire properties on bonding quality
27. Electrochemical studies of Pd-doped Cu and Pd-doped Cu–Al intermetallics for understanding corrosion behavior in wire-bonding packages
10.1016/j.microrel.2017.09.024 ↗29. Characterization of rate-dependent constitutive behavior of copper free-air ball and its use for wire bonding process simulation
10.1109/tcpmt.2018.2827842 ↗30. An investigation on mechanical behavior on Pt-coated copper wire from a nanoscale perspective
10.1149/1.3694413 ↗32. Factors affecting ball hardness in copper wire bonding
37. Some aspects on free air ball (FAB) formation of copper wire bonding
38. Research progress in diffusion in liquid metals under microgravity