Stability of low-carrier-density topological-insulator Bi2Se3 thin films and effect of capping layers
Source abstract
Abstract
Although over the past number of years there have been many advances in the materials aspects of topological insulators (TIs), one of the ongoing challenges with these materials is the protection of them against aging. In particular, the recent development of low-carrier-density bulk-insulating Bi2Se3 thin films and their sensitivity to air demands reliable capping layers to stabilize their electronic properties. Here, we study the stability of the low-carrier-density Bi2Se3 thin films in air with and without various capping layers using DC and THz probes. Without any capping layers, the carrier density increases by ∼150% over a week and by ∼280% over 9 months. In situ-deposited Se and ex situ-deposited poly(methyl methacrylate) suppress the aging effect to ∼27% and ∼88%, respectively, over 9 months. The combination of effective capping layers and low-carrier-density TI films will open up new opportunities in topological insulators.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Topological Materials and Phenomena · Chemical and Physical Properties of Materials · Advanced Thermoelectric Materials and Devices
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
Affiliations
Department of Materials Science and Engineering, Rutgers, The State University of New Jersey, Piscataway, New Jersey 08854, USA
Department of Physics and Astronomy, Rutgers, The State University of New Jersey, Piscataway, New Jersey 08854, USA
Department of Physics and Astronomy, The Institute for Quantum Matter, The Johns Hopkins University, Baltimore, Maryland 21218, USA
Funding
National Science Foundation (NSF) · Office of Naval Research (ONR) · Gordon and Betty Moore Foundation
References (18)
Show source-provided references
1. 10.1103/RevModPhys.82.304510.1103/RevModPhys.82.3045 ↗
2. 10. 1038/nature0891610. 1038/nature08916 ↗
3. 10.1103/PhysRevLett.98.10680310.1103/PhysRevLett.98.106803 ↗
4. 10.1038/nphys127010.1038/nphys1270 ↗
5. 10.1038/nphys127410.1038/nphys1274 ↗
6. 10.1063/1.480191110.1063/1.4801911 ↗
7. 10.1063/1.360748410.1063/1.3607484 ↗
8. 10.1021/nn200556h10.1021/nn200556h ↗
9. 10.1103/PhysRevLett.109.11680410.1103/PhysRevLett.109.116804 ↗
10. 10.1016/j.tsf.2011.07.03310.1016/j.tsf.2011.07.033 ↗
11. 10.1063/1.488434810.1063/1.4884348 ↗
12. 10.1038/nphys264710.1038/nphys2647 ↗
13. 10.1038/nnano.2013.13410.1038/nnano.2013.134 ↗
14. 10.1103/physrevlett.113.02680110.1103/physrevlett.113.026801 ↗
15. 10.1016/j.ssc.2014.10.02110.1016/j.ssc.2014.10.021 ↗
16. 10.1007/s12274-014-0607-810.1007/s12274-014-0607-8 ↗
17. 10.1103/PhysRevB.82.12512010.1103/PhysRevB.82.125120 ↗
18. 10.1021/nn502031k10.1021/nn502031k ↗