Wetting in Soldering and Microelectronics
Source abstract
Abstract
Wettability of solid metals by molten solders is reviewed. The contact angle and wetting force are tabulated for various combinations of solid metals and molten solders such as Sn-Pb base alloys, Sn-Ag base alloys, Sn-Zn base alloys, Sn-Cu base alloys, and Sn-Bi base alloys. Studies on the wetting rate are also discussed.
Source: openalex_inverted_index · Quality: baseline
Research context
OpenAlex topics: Electronic Packaging and Soldering Technologies · 3D IC and TSV technologies · Adhesion, Friction, and Surface Interactions
SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.
References
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