Yellow Mealworm Larvae Derived Eco‐Friendly Substrates for Responsible Electronics

Abstract The growth of the electrical and electronic industries has led to an inevitable increase in e‐waste, posing potential risks to human health. To mitigate this issue, eco‐friendly and biocompatible substrates derived from food‐based materials can offer a sustainable alternative for responsible electronic circuit integration, helping to reduce e‐waste. In this study, a yellow mealworm larva (YML)‐based substrate is proposed, aligning with the principles of green electronics. The prepared substrate is characterized using FTIR, SEM, Optical microscopy, water contact angle analysis, TGA, and dielectric properties measurements. To evaluate the biodegradability of YML substrate, comprehensive studies are performed, including moisture absorption rate, water degradation rate, and soil degradation rate, providing a thoughtful study of its environmental breakdown behavior. The dielectric properties (dielectric constant, dielectric loss) and resistivity of the substrate are thoroughly evaluated for the YML substrate. The results demonstrate favorable thermal and electrical properties. As a proof‐of‐concept, LC electrical circuits are fabricated using the YML‐based substrate and compared with the commercially available substrates (FR4), to assess its suitability for electronic applications. The developed YML substrates show strong potential for use in RF and high‐frequency electronic circuit applications, maintaining consistent performance even under fluctuating environmental conditions.