journal article·2022-06-01

The integration of electronic circuits in plastics using injection technologies: a literature review

Mona Bakr, Frederick Bossuyt, Jan Vanfleteren

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Abstract

Abstract A great deal of attention has been paid in recent years to the integration of two and three-dimensional integrated electronic parts into plastics, both for their potential applications in modern human lives and for their outstanding properties, which include the ability to reduce product weight and space while increasing product reliability. The development of integrated electronic devices into plastics is advancing rapidly, owing to advancements in methodology and manufacturing techniques, which have significantly raised researcher interest in this topic. In-mold electronics (IME) is a term that describes an injection molding technology that integrates a printed foil with electrical components into a plastic part during the molding process. It is a revolutionary way to form two and three-dimensional products using electronic printed circuits. IME technology is comprised of three fundamental disciplines of study: electronics, materials science, and plastic manufacturing processes. Therefore, this review article aims to summarize the knowledge of these three primary fields to present an overview of in-mold technology. This article covers background history, a description of the In-mold process flow, and summarizes the recent real-life applications. Additionally, this article discusses some of the present technology challenges that must be overcome.
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Research context

OpenAlex topics: Injection Molding Process and Properties · Nanomaterials and Printing Technologies · Additive Manufacturing and 3D Printing Technologies

SciVX discovery tags are terminology-based. OpenAlex topics are source-provided classifications.

References (94)

Show source-provided references
1. Injection molding in polymer matrix composites10.1533/9780857096258.1.13 ↗
2. Minimization of sink mark defects in injection molding process—Taguchi approach10.4314/ijest.v2i2.59133 ↗
3. P̈tsch · 2008
4. A brief review on injection moulding manufacturing process10.1016/j.matpr.2017.01.164 ↗
5. Embedding of electronics within thermoplastic polymers using injection moulding technique10.1109/IEMT.2000.910703 ↗
6. In-Mold electronics: starting simple to reach one billion dollars
7. Beltrão · Polym. Eng. Sci. · 2022 · 62 · 96710.1002/pen.25918 ↗
8. Jawitz · 1997
9. How secure are printed circuit boards Trojan attacks?10.1109/MDAT.2014.2347918 ↗
10. Research, Energias Market
11. Types of printed circuit boards
12. Learn about different types of pcbs and their advantages
13. Prime Faraday technology watch
14. IPC · 1996
15. Five benefits of flexible electronics for displays and sensors
16. Difference between thermoset and thermoplastic
17. Patterning processes for flexible electronics10.1109/JPROC.2015.2401553 ↗
18. About flexible hybrid electronics (FHE)
19. Street · 2017 · vol10.1117/12.2275561 ↗
20. Flexible hybrid electronics 2020-2030: applications, challenges, innovations and forecasts
21. Molded interconnect devices
22. Franke · 2014
23. Laser supported activation and additive metallization of thermoplastics for 3D-MIDs
24. 3D integration of electronics and mechanics10.1109/ISAPM.2005.1432035 ↗
25. Integration of multilayer PWB into plastic covers by injection moulding10.1109/ESTC.2006.280185 ↗
27. Conformable electronics: integration of electronic functions into static and dynamic free form surfaces10.1109/ICSJ47124.2019.8998743 ↗
28. Optimized thermoforming process for conformable electronics10.1109/ICMID.2018.8526929 ↗
29. Deformation characteristics and resistance distribution in thermoforming of printed electrical circuits for in-mold electronics application10.1007/s00170-020-05377-9 ↗
30. Thermo-plastically stretchable electronic and sensor circuits10.1109/ICEPT.2016.7583384 ↗
31. Component packages for IMSETM (Injection molded structural electronics)
32. Printocent · 2020 · 77
33. Adhesion control for injection overmolding of elastomeric propylene copolymers on polypropylene. Effects of block and random microstructures10.1016/j.ijadhadh.2013.05.016 ↗
34. Adhesion control for injection overmolding of polypropylene with elastomeric ethylene copolymers10.1002/pen.21415 ↗
35. Experimental investigation of the adhesion between thermoplastic polyurethane and acrylonitrile-butadiene-styrene substrate10.1115/MSEC2014-3927 ↗
36. Media-tight polymer-polymer assemblies by means of sintered powder layer in assembly injection moulding10.1016/j.promfg.2020.04.286 ↗
37. Overmolded hybrid composites of polyamide-6 on continuous carbon and glass fiber/epoxy composites: ‘An assessment of the interface,10.1016/j.compositesa.2020.105771 ↗
38. Interfacial characteristics of film insert molded polycarbonate film/polycarbonate‐acrylonitrile‐butadiene‐styrene substrate, part 1: influence of substrate molecular weight and film thickness10.1002/pen.20644 ↗
39. Effect of crystallization and interface formation mechanism on mechanical properties of film-insert injection-molded poly(propylene) (PP) film/PP substrate10.1002/app.21590 ↗
40. Effect of decoration film on mold surface temperature during in-mold decoration injection molding process10.1016/j.icheatmasstransfer.2010.01.005 ↗
41. Effects of insert film on asymmetric mold temperature and associated part warpage during in-mold decoration injection molding of PP parts10.1016/j.icheatmasstransfer.2012.11.002 ↗
42. Development and characterization of poly(ethylene terephthalate) based injection molded self-reinforced composites. Direct reinforcement by overmolding the composite inserts10.1016/j.matdes.2018.04.084 ↗
43. Thermoplastic overmolding onto injection-molded and in situ polymerization-based polyamides10.3390/ma11112140 ↗
44. Adhesion phenomena in bonded joints10.1016/j.ijadhadh.2012.04.007 ↗
46. Creton · 2001 · 53
47. Adhesion between immiscible polymers correlated with interfacial entanglements10.1021/ma020789t ↗
48. A new frontier of printed electronics: flexible hybrid electronics10.1002/adma.201905279 ↗
49. Polymers in conventional and alternative lithography for the fabrication of nanostructures10.1016/j.eurpolymj.2011.07.025 ↗
50. Printing technologies on flexible substrates for printed electronics10.5772/intechopen.76161 ↗
51. Inkjet-printed organic field-effect transistor by using composite semiconductor material of carbon nanoparticles and poly(3-Hexylthiophene)10.1155/2011/142890 ↗
52. Enhancement of carrier mobility in all-inkjet-printed organic thin-film transistors using a blend of poly(3-hexylthiophene) and carbon nanoparticles10.1016/j.tsf.2011.05.071 ↗
53. Recent developments and applications of screen-printed electrodes in environmental assays-review10.1016/j.aca.2012.05.018 ↗
54. Haffarzadeh · 2012
55. High-quality inkjet-printed multilevel interconnects and inductive components on plastic for ultra-low-cost RFID applications
56. One-step inkjet printing of conductive silver tracks on polymer substrates10.1088/0957-4484/20/16/165303 ↗
57. DuPont in-mold electronic technology
58. ECM · 2019
59. Creative materials
60. Computational thermoforming10.1145/2897824.2925914 ↗
61. Coloring 3D printed surfaces by thermoforming10.1109/TVCG.2016.2598570 ↗
62. Rubin · 1991 · 13310.1007/978-1-4615-7604-4_5 ↗
63. Review of recent developments in injection molding process for polymeric materials
64. Throne · 2008 · 2
65. Kalpakjian · 2007
66. The outline of injection molding
67. The cycles of the injection moulding process
68. Glob Top encapsulation
69. DuraTech · 2019
70. In-mold electronics design & manufacturing at Eastprint, Inc.
71. TactoTek Oy · 2019
72. IDTechEx research asks, in-mold electronics: challenges in every step?
73. In-Mold electronics 2020-2030: technology, market forecasts, players
74. Hybrid in-mould integration for novel electrical and optical features in 3D plastic products10.1109/ESTC.2012.6542129 ↗
75. Injection molded structural electronics brings surfaces to life10.23919/EMPC44848.2019.8951795 ↗
76. R2R process for integrating LEDs on flexible substrate10.1109/NORDPAC.2017.7993155 ↗
77. Solar cells integration in over-molded printed electronics10.1109/ESTC48849.2020.9229822 ↗
78. Flexible microsystems using over-molding technology10.1016/j.promfg.2020.11.006 ↗
79. New standards for 3D-userinterfaces-manufactured by a film insert molding process10.1109/ICMID.2018.8526978 ↗
80. Printed GNSS and bluetooth antennas embedded on flexible low loss substrates for wearable applications10.2528/PIERM20042303 ↗
81. Indoor air quality sensing indicators10.1109/ESTC.2016.7764711 ↗
82. Adopting hybrid integrated flexible electronics in products: case—personal activity meter10.1109/IFETC.2018.8583901 ↗
83. Bakr · Flex. Print. Electron. · 2021 · 610.1088/2058-8585/ac03bf ↗
84. Evaluation of mechanical stress on electronic assemblies during thermoforming and injection molding for conformable electronics10.1109/MID50463.2021.9361624 ↗
85. Manufacturing of sandwich structures for the integration of electronics in in mold labelling components10.1109/ICMID.2016.7738922 ↗
86. In-mould integration of electronics into mechanics and reliability of overmoulded electronic and optoelectronic components
87. Over-molding of two-dimensional curved shape using polyimide copper cladding foil10.23919/EMPC53418.2021.9584946 ↗
88. Hybrid process chain for the integration of direct ink writing and polymer injection molding10.3390/mi11050509 ↗
89. Three-dimensional printed electronics10.1038/518042a ↗
90. Printed and hybrid integrated electronics using bio-based and recycled materials—increasing sustainability with greener materials and technologies10.1007/s00170-020-06029-8 ↗
91. Flexible, organic and biodegradable: Stanford researchers develop new wave of electronics
92. Biodegradable flexible electronics: a new option for greater sustainability
93. Top 5 biodegradable resins for your plastic injection molding project
94. Energy analysis of bioplastics processing10.1016/j.procir.2016.11.181 ↗